Silver Flake Conductive Layer for Touch Identifier Yield
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Solution Overview
Problem
The existing methods for forming conductive layer patterns on multi-touch displays require a significant amount of silver paste, leading to increased manufacturing costs and uneven quality due to the thickness and area requirements, which complicates mass production.
Innovation Solution
A conductive layer pattern is formed using a minimum amount of silver paste with silver flakes of specific particle size and thickness, applied in a predetermined pattern on an insulator base, achieving the necessary conductivity with a minimal area and thickness, and using screen printing for cost-effective mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of silver paste is coated on the base to ensure sufficient conductivity and capacitance change, then the conductivity requirement is met, but the manufacturing cost increases significantly and uneven quality occurs
Solution Approach 1:
The invention changes the physical parameters of the silver paste by controlling particle size distribution (mixing fine particles of 0.5-2.0 μm with coarse particles of 2.0-5.0 μm) and thickness (controlling the conductive layer to 3.0-10.0 μm). This parameter optimization allows achieving sufficient conductivity with reduced silver paste quantity, thereby lowering manufacturing cost while maintaining reliability
Solution Approach 2:
The invention uses a composite structure by combining silver paste with a binder resin to form a conductive layer. The composite material approach allows the fine silver particles to fill gaps between coarse particles, creating efficient conductive pathways with less total silver content, thus reducing cost while maintaining conductivity requirements
2Reliability
If a large amount of silver paste is used to form the conductive layer pattern, then the capacitance change is sufficient, but the area requirement increases and mass production becomes complicated
Solution Approach 1:
The invention optimizes the thickness parameter of the conductive layer to 3.0-10.0 μm and controls silver paste particle size distribution. These parameter changes enable achieving sufficient capacitance change with a smaller area conductive layer, simplifying the printing process and improving mass production efficiency
Solution Approach 2:
The invention creates non-uniform local quality within the conductive layer by mixing fine and coarse silver particles. The fine particles concentrate in regions requiring higher conductivity, while coarse particles provide structural framework. This local optimization allows reduced overall area while maintaining sufficient capacitance change performance
3Ease of manufacture
If the conductive layer pattern is made with minimal silver paste, then the manufacturing cost is reduced, but the conductivity may become insufficient
Solution Approach 1:
The invention carefully balances multiple parameters: silver paste particle size (0.5-5.0 μm mixed distribution), conductive layer thickness (3.0-10.0 μm), and silver paste quantity. This optimized parameter combination ensures sufficient conductivity is achieved with minimal silver paste, reducing manufacturing cost while meeting reliability requirements
Solution Approach 2:
The conductive layer is formulated as a composite material with fine silver particles (0.5-2.0 μm) and coarse silver particles (2.0-5.0 μm) mixed in specific ratios with binder resin. This composite structure maximizes conductive efficiency per unit volume of silver paste, achieving sufficient conductivity with reduced material quantity and lower cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs while maintaining good yield and conductivity, enabling efficient mass production of identifier providing devices for computer devices.
Implementation Method 1
using screen printing for cost-effective mass production
Data Source
AI summary
A mass produced identifier providing device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 μm and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 μm or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.