Silver-Free Active Solder Composition for Ceramic Metallization
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Solution Overview
Problem
Existing soldering materials for active soldering of electronic components on ceramic substrates are costly due to high silver content and prone to silver migration under electrical fields.
Innovation Solution
A silver-free soldering material comprising copper and a copper alloy, with a main component of copper and an active metal like Hf, Ti, or Zr, which forms a bond with ceramics through a reaction layer, reducing manufacturing costs and preventing silver migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high silver content is used in soldering material for active soldering below 1000°C, then bonding reliability is improved, but material cost increases and silver migration risk occurs
Solution Approach 1:
The patent removes silver from the soldering material composition entirely, extracting the harmful element that causes migration while maintaining bonding functionality through alternative metal combinations (copper-based alloys with reactive metals like Ti, Zr, Hf)
Solution Approach 2:
The patent replaces expensive silver with more economical copper-based materials, reducing material cost while achieving comparable bonding performance through the synergistic combination of copper with reactive metal additives
2Strength
If high silver content is used in soldering material, then bonding strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent substitutes expensive silver with cost-effective copper and copper alloys, significantly reducing material costs while maintaining bonding strength through the addition of reactive metals that enhance adhesion to ceramic substrates
3Ease of manufacture
If copper-based soldering material without silver is used, then cost is reduced and silver migration is prevented, but bonding reliability may be compromised
Solution Approach 1:
The patent creates a composite soldering material combining copper with reactive metals (Ti, Zr, Hf) and other alloying elements, where each component contributes specific properties: copper provides ductility and electrical conductivity, while reactive metals ensure strong adhesion to ceramic surfaces
Solution Approach 2:
The patent modifies the chemical composition parameters of the soldering material by adjusting the ratios of copper, reactive metals, and alloying elements to optimize both bonding reliability and cost-effectiveness for active soldering processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective soldering with reduced silver migration, allowing for durable and safe bonding of metallization to ceramic substrates without the need for high silver content, while maintaining suitable melting temperatures and mechanical strength.
Implementation Method 1
an active metal like Hf, Ti, or Zr, which forms a bond with ceramics through a reaction layer
Data Source
AI summary
A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.