Silver Getter Tubes for Hermetic Package Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ceramic hermetic packages face challenges in managing moisture and heat transfer, leading to potential failure in thermal performance and high costs, especially when embedded silicon devices do not adequately transfer heat to the ceramic package.
Innovation Solution
A semiconductor package design featuring a ceramic header with a cavity, a lid structure, and silver tubes filled with a getter material, where nano-scale silver material is used for bonding and thermal paths, along with a seam seal to create a hermetic enclosure with dual-sided cooling capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic hermetic packages are used for physical and atmospheric protection, then reliability is improved, but thermal performance deteriorates when embedded silicon devices do not sufficiently transfer heat
Solution Approach 1:
Silver tubes filled with getter material are introduced as intermediary elements between the silicon device and the ceramic package environment. These tubes serve dual functions: maintaining hermetic protection while providing thermal conduction pathways, thus mediating between the conflicting requirements of hermetic sealing and heat dissipation.
Solution Approach 2:
The package structure combines multiple materials with complementary properties: ceramic for hermetic protection, silver for thermal conduction, and getter material for moisture absorption. This composite approach allows simultaneous achievement of hermetic reliability and improved thermal performance.
2Reliability
If sealed ceramic hermetic packages are used, then protection against ambient disturbances is improved, but control of moisture and heat transfer becomes difficult
Solution Approach 1:
Getter material within the silver tubes acts as an intermediary that passively controls moisture without requiring active management. The getter material absorbs moisture internally, simplifying moisture control while maintaining the hermetic seal's protective function.
Solution Approach 2:
The getter material provides self-service moisture control by automatically absorbing excess moisture within the package through adsorption, eliminating the need for external moisture management systems and reducing device complexity.
3Temperature
If nano-scale silver material is used for bonding silver tubes, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The invention changes the physical state and size parameters of silver material to the nano-scale, which dramatically improves thermal conductivity. The sintering process then consolidates these nano-particles into functional bonding structures, achieving superior thermal performance despite the complexity introduced by nanomaterial handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal dissipation and reduces moisture-related failures by utilizing silver tubes with getter material to maintain hermeticity, improving thermal conductivity and reducing the risk of Residual Gas Analysis (RGA) failures, while maintaining a cost-effective solution.
Implementation Method 1
The one or more silver tubes are hollow and filled with a getter material
Implementation Method 2
Moisture content in ceramic hermetic packages can be evaluated using Residual Gas_analysis (RGA)
Implementation Method 3
The nano-scale silver material is bonded by sintering... a second thermal path from the semiconductor die to a top surface of the package via the one or more silver tubes and the lid structure
Implementation Method 4
The nano-scale silver material is bonded by sintering
Implementation Method 5
A seal ring is located between the top surface of the ceramic header and the lid structure... a seam seal between the lid structure and the ceramic header
Data Source
AI summary
An example semiconductor package comprises a ceramic header having a top surface and a cavity formed within the ceramic header. The cavity is open at the top surface. A semiconductor die is mounted within the cavity of the ceramic header. A lid structure is coupled to the top surface of the ceramic header. The lid structure and ceramic header form a portion of a package enclosing the semiconductor die. One or more silver tubes are in contact with a first surface of the semiconductor die and with a first surface of the lid structure. A seal ring is located between the top surface of the ceramic header and the lid structure. The seal ring couples the lid structure to the ceramic header. The one or more silver tubes are hollow and filled with a getter material.