Silver-Heterocycle Catalytic Composition for Conductive Patterns
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Solution Overview
Problem
Current methods for producing electrically-conductive films, particularly for touch screen displays, face challenges with the use of Indium Tin Oxide (ITO) due to its high cost, limited availability, and requirement for high processing temperatures, while also struggling with the dispersion of silver particles in photocurable compositions for electroless plating, leading to non-uniform and less effective conductive patterns.
Innovation Solution
A non-aqueous metal catalytic composition comprising a complex of silver and a hindered aromatic N-heterocycle with reducible silver ions and a silver ion photoreducing composition, which is photocured to generate silver particles in situ, eliminating the need for pre-dispersion of silver particles and allowing for electroless plating of other metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Indium Tin Oxide (ITO) is used to create conductive films for touch screen displays, then conductive patterns can be formed, but the cost is high and availability is limited due to ITO being an expensive rare earth metal from few sources
Solution Approach 1:
The patent replaces expensive and scarce ITO with silver, which is abundant and significantly cheaper. Silver particles are deposited as conductive patterns on substrates, providing a cost-effective alternative that maintains electrical conductivity while eliminating dependency on limited ITO supplies
Solution Approach 2:
The patent changes the material parameter from ITO to silver, and further optimizes by controlling silver particle size, distribution, and morphology through specific deposition techniques to achieve desired electrical properties while reducing cost and improving availability
2Reliability
If ITO coatings are used to achieve adequate response rates, then conductivity can be maintained, but line lengths must be kept short which requires breaking up touch screens into smaller segments
Solution Approach 1:
The patent changes the conductive material from ITO to silver, which has superior electrical conductivity (50 to 100 times greater than ITO). This parameter change allows for longer conductive line lengths without compromising response rates, thereby reducing the need for segmentation and simplifying device architecture
3Reliability
If ITO is used as a ceramic material for conductive layers, then conductivity can be achieved, but the material cannot be readily bent or flexed
Solution Approach 1:
The patent transitions from using ceramic ITO to metallic silver particles as the conductive material. This parameter change fundamentally alters the mechanical properties, enabling the conductive layer to be flexible and bendable while maintaining electrical conductivity, thus expanding adaptability for flexible display applications
4Reliability
If ITO conductive layers are prepared using vacuum deposition, then conductive films can be formed, but high processing temperatures are required
Solution Approach 1:
The patent replaces ITO with silver and uses alternative deposition methods that operate at lower temperatures. This substitution eliminates the need for high-temperature vacuum deposition processes, reducing energy consumption and enabling deposition on temperature-sensitive substrates
Solution Approach 2:
The patent changes the deposition process parameters by using silver-based formulations that can be deposited at lower temperatures through alternative mechanisms, replacing the high-temperature vacuum deposition requirement of ITO with more energy-efficient processes
5Reliability
If silver particles are pre-dispersed for electroless plating, then catalytic sites can be provided, but the dispersion is non-uniform leading to less effective conductive patterns
Solution Approach 1:
The patent employs silver particles that self-assemble or self-distribute uniformly during the deposition process without requiring pre-dispersion. The particles naturally form uniform patterns on the substrate, eliminating the need for complex dispersion steps and ensuring consistent catalytic site distribution for effective electroless plating
Solution Approach 2:
The patent optimizes particle size, surface properties, and deposition conditions to achieve uniform silver particle distribution directly during the deposition process. This parameter optimization eliminates the need for pre-dispersion steps while ensuring uniform catalytic site formation for effective electroless plating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of uniform electrically-conductive patterns with improved conductivity and reduced processing complexity, suitable for high-speed manufacturing, by generating silver particles directly in the film, thus overcoming the limitations of ITO and silver particle dispersion issues.
Implementation Method 1
a silver ion photoreducing composition
Implementation Method 2
a photocurable component or non-curable polymer
Data Source
AI summary
A non-aqueous metal catalytic composition includes (a) a complex of silver and a hindered aromatic N-heterocycle comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component, a non-curable polymer, or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.