Silver Ink Composition with Oxime Reducing Agent
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Solution Overview
Problem
Silver ink compositions face challenges with stability during storage and high decomposition temperatures, limiting their application in forming metal patterns on various substrates, and require longer sintering times, which hampers production efficiency and electrical conductivity.
Innovation Solution
Incorporating an oxime-based compound as a reducing agent into a silver complex compound, formed by reacting silver compounds with ammonium carbamate- or ammonium carbonate-based compounds, to enhance stability and allow low-temperature sintering, thereby reducing sintering time and improving surface uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal carboxylate complexes including silver are used, then ease of preparation is improved, but stability during storage deteriorates due to susceptibility to light and decomposition at high temperature
Solution Approach 1:
The patent changes the chemical parameters of the complex compound by replacing traditional carboxylate ligands with hydroxamic acid ligands. This chemical substitution fundamentally alters the stability parameters of the silver complex, making it resistant to light and high temperature while maintaining ease of preparation through similar coordination chemistry mechanisms.
Solution Approach 2:
The invention creates a composite coordination compound structure where silver ions are coordinated with hydroxamic acid ligands forming a stable complex. This composite structure combines the benefits of silver's electrical conductivity with the enhanced stability of the hydroxamic acid coordination sphere, resolving the contradiction between ease of preparation and storage stability.
2Ease of manufacture
If traditional silver compounds are used, then ease of preparation is improved, but decomposition temperature increases limiting application on various substrates
Solution Approach 1:
The patent modifies the thermal parameters of the silver compound by introducing hydroxamic acid ligands. This chemical modification lowers the decomposition temperature to below 200°C, enabling application on temperature-sensitive substrates while maintaining the simplicity of preparation through standard coordination reactions.
3Reliability
If conventional silver ink compositions are used, then electrical conductivity can be achieved, but sintering time increases reducing production efficiency
Solution Approach 1:
The patent changes the sintering parameters by using hydroxamic acid silver complexes that decompose at lower temperatures and form conductive silver patterns more rapidly. This reduces the sintering time required to achieve the same electrical conductivity, thereby improving production efficiency without sacrificing conductivity quality.
4Stability of the object's composition
If silver compounds with high decomposition temperature are used, then stability is improved, but surface uniformity deteriorates affecting reflectance
Solution Approach 1:
The patent optimizes the decomposition parameters of the silver compound by selecting hydroxamic acid ligands with appropriate thermal stability. This creates a compound that decomposes uniformly at moderate temperatures, producing smooth, uniform silver surfaces with high reflectance while maintaining adequate storage stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silver ink composition achieves excellent stability during storage, enables low-temperature sintering, forms compact thin films with high electrical conductivity, and improves reflectance while significantly reducing sintering time, thus enhancing production efficiency.
Implementation Method 1
adding an oxime-based compound as a reducing agent into a silver complex compound
Data Source
AI summary
The present invention relates to a silver ink composition comprising: silver complexes obtained by reacting one or more silver compounds selected from chemical formula 1 with one or more ammonium carbamate-based compounds or ammonium carbonate-based compounds selected from chemical formula 2 to chemical formula 4; and oxime-based compounds.