Silver Ink Composition for High Conductivity With Lower Silver Content

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Solution Overview

Problem

Conductive ink compositions face challenges in achieving high electric conductivity while maintaining low raw material costs, as reducing silver powder content lowers binder resin amounts, leading to poor screen printability and difficulty in forming conductive paths within short baking times.

Innovation Solution

A conductive ink composition with flake-shaped silver powder and high molecular weight binder resin, optimized with oleic acid surfactant coverage to maintain particle stability and reduce excess fatty acids, achieving a silver powder content of 45-70% and binder resin content of 5-15% by weight, with an ink viscosity of 10-25 Pa·s, allowing for high conductivity and low material costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If silver powder content is reduced to lower raw material costs, then cost decreases, but electric conductivity and screen printability deteriorate

Engineering Contradiction:
Improveelectric conductivityVSAvoidsilver powder content
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent changes the particle size parameter of silver powder to 3 μm or less, which increases surface area and improves conductivity. It also optimizes the binder resin molecular weight to 20,000 or less and controls fatty acid content to 50 ppm or less, creating a combination of parameters that achieves high conductivity with reduced silver content

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite ink composition combining ultrafine silver powder with specific binder resins and controlled fatty acid amounts. This composite approach allows the system to achieve properties (high conductivity, good printability) that individual components cannot provide alone, enabling reduced silver content while maintaining performance

Inventive Principle:
Principle #40Composite materials

2Reliability

If binder resin amount is reduced to lower costs, then raw material cost decreases, but screen printability and ink viscosity deteriorate

Engineering Contradiction:
Improvescreen printabilityVSAvoidbinder resin content
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent optimizes the molecular weight parameter of the binder resin to 20,000 or less, which provides adequate viscosity and printability with minimal resin content. It also controls the binder resin content to 5-20% by weight, achieving the right balance between cost reduction and maintaining screen printability

Inventive Principle:
Principle #35Parameter changes

3Reliability

If baking time is extended to achieve high conductivity, then electric conductivity improves, but production efficiency and productivity decrease

Engineering Contradiction:
Improveelectric conductivityVSAvoidbaking speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes multiple parameters simultaneously: ultrafine silver powder (3 μm or less) for rapid sintering, low molecular weight binder resin (20,000 or less) for fast evaporation, and controlled fatty acid content (50 ppm or less) to prevent oxidation. This parameter combination enables high conductivity to be achieved in just 60 seconds at 150°C

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent performs preliminary surface treatment of silver powder by controlling fatty acid content to 50 ppm or less before printing. This preliminary action prevents oxidation and prepares the surface for rapid bonding during the short 60-second baking process, enabling quick achievement of high conductivity without extended baking time

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ink composition achieves high electric conductivity of 20 μΩ·cm or less under a short baking condition of 150°C for 60 seconds, with improved printability and reduced raw material costs, while minimizing coarse particles and maintaining stability.

Implementation Method 1

containing a conductive metal particle (A) having an oleic acid surfactant

Methodology Applied
Scientific EffectSurfactant: Surfactant

Implementation Method 2

oleic acid surfactant coverage to maintain particle stability

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 3

under a short baking condition of 150°C for 60 seconds

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 4

drying or hardening a printed coating film

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 5

achieving high conductivity and low material costs

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 6

highly conductive silver ink composition... achieves high electric conductivity of 20 μΩ·cm or less

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11939482B2Highly electrically conductive silver ink composition and wiring obtained using same
Publication Date: 2024.03.26 DIC CORP

AI summary

A conductive ink composition for screen printing contains a conductive metal particle (A) having an oleic acid surfactant, a non-chlorine-based resin composition (B), and an organic solvent (C), wherein the conductive metal particle (A) is contained in an amount of 45 to 70% by weight with respect to the total ink composition, the non-chlorine-based resin composition (B) has a number average molecular weight of 50,000 or more and is contained in an amount of 5 to 15% by weight with respect to the total ink composition, the organic solvent (C) has a flash point of 75 to 110° C. and is contained in an amount of 25 to 50% by weight with respect to the total ink composition, and the ink composition has an ink viscosity of 10 to 25 Pa·s (23° C.) at a shear rate of 100 s−1.