Silver Ion Diffusion-Suppressing Layer Composition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of metal interconnects in circuit boards leads to increased likelihood of silver ion migration, causing short circuits and deteriorating insulation reliability, as existing methods using thiol-containing compounds face challenges in uniform dispersion and polymer degradation.
Innovation Solution
A composition containing a compound with specific functional groups such as triazole, thiadiazole, or benzimidazole structures, along with a mercapto group and a hydrocarbon group, is used to form a silver ion diffusion-suppressing layer, improving dispersibility and suppressing ion migration without degrading the insulating resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thiol-containing compound is introduced into a polymer layer to suppress ion migration, then the insulation reliability is improved, but the compound shows low dispersibility and causes polymer degradation
Solution Approach 1:
The patent uses silane-modified thiol-containing compounds as intermediary substances that can simultaneously interact with both the polymer matrix and metal ions. The silane group serves as a bridge that provides compatibility with the polymer while the thiol group maintains ion migration suppression capability, thus resolving the contradiction between polymer stability and insulation reliability.
Solution Approach 2:
The patent modifies the chemical structure of the thiol-containing compound by introducing silane groups, which changes the physical and chemical parameters of the compound. This structural modification improves dispersibility in the polymer matrix and reduces polymer degradation while maintaining the ability to suppress silver ion migration.
2Length of moving object
If the spacing between metal interconnects is reduced for miniaturization, then the device size is reduced, but the likelihood of short circuit due to ion migration increases
Solution Approach 1:
The patent applies preliminary protective action by incorporating silane-modified thiol-containing compounds into the polymer layer before ion migration can occur. This pre-established protection mechanism actively suppresses silver ion migration even when interconnect spacing is reduced, preventing short circuits before they can happen.
3Reliability
If a large amount of metal ion adsorbing compound is introduced into the polymer layer, then the ion migration suppression effect is enhanced, but the compound deposits and causes polymer deterioration
Solution Approach 1:
The patent changes the chemical parameters of the metal ion adsorbing compound by introducing silane modification. This structural change improves the compound's compatibility with the polymer matrix, allowing for better dispersion at lower concentrations and reducing deposition effects while maintaining effective ion migration suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces silver ion migration, enhancing insulation reliability between metal interconnects and preventing short circuits, while maintaining the integrity of the polymer layer.
Implementation Method 1
a compound which includes: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group
Implementation Method 2
a compound such as a thiol-containing compound which may form an organometallic salt with a metal ion
Implementation Method 3
the dispersibility in the polymer layer of the metal ion adsorbing compound such as the thiol-containing compound as disclosed in JP 2008-192850 A affects the suppression of ion migration
Data Source
AI summary
A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects.