Silver Nanowire Flexible Array Substrate for Bendable Displays

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Solution Overview

Problem

Flexible display devices suffer from low yield and high costs due to line breaks caused by deformation and poor bending resistance of ultra-thin substrates, particularly with materials like aluminum, copper, and indium tin oxide.

Innovation Solution

A method of manufacturing a flexible array substrate using silver nanowires to form electrically conductive patterns, which includes forming silver nanowire layers and patterning them to create electrodes, thereby reducing trace resistance and improving bending resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If ultra-thin flexible substrates are used to achieve flexibility, then bendability is improved, but line breaks of internal traces occur due to thermal expansion and contraction

Engineering Contradiction:
ImprovebendabilityVSAvoidline breaks of internal traces
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent changes the material parameter from conventional metals (aluminum, copper, molybdenum) to silver nanowires, which have different thermal expansion characteristics and superior flexibility. This parameter change allows the traces to withstand thermal expansion and contraction during manufacturing processes without breaking, while maintaining the required electrical conductivity and flexibility of the display device.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs silver nanowires as a composite material that combines the advantages of metal conductivity with the flexibility and ductility of nanoscale structures. The silver nanowire network forms a mesh-like structure that can deform elastically during thermal cycles and bending, preventing line breaks while maintaining electrical connectivity.

Inventive Principle:
Principle #40Composite materials

2Reliability

If conventional metal materials (aluminum, copper, molybdenum) or indium tin oxide are used for traces, then electrical conductivity is achieved, but ductility and bending resistance are low causing breakage

Engineering Contradiction:
Improveelectrical conductivityVSAvoidductility and bending resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent fundamentally changes the material parameters by transitioning from bulk metals to nanoscale silver nanowires. This size reduction to the nanoscale provides exceptional ductility and bending resistance while maintaining high electrical conductivity. The nanowire structure can undergo large deformations without breaking, solving the brittleness issue of conventional trace materials in flexible displays.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses silver nanowires that form a flexible, mesh-like network structure on the substrate. This nanowire network acts as a flexible conductive film that can bend and deform with the flexible substrate, providing both the required electrical conductivity and the mechanical flexibility needed to prevent breakage during device bending and thermal cycling.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If silver nanowire material is used to form electrically conductive patterns, then bending resistance and trace resistance are improved, but manufacturing process complexity increases

Engineering Contradiction:
Improvebending resistance and trace resistanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical sputtering or evaporation processes with a chemical solution-based silver nanowire deposition method. The silver nanowires are suspended in a solution that is coated onto the substrate, followed by a simple drying or mild heating process to remove the solvent. This substitution of the deposition mechanism dramatically simplifies the manufacturing process while achieving superior trace performance.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the manufacturing parameters from high-vacuum, high-energy physical vapor deposition to low-temperature, solution-based processing. This parameter change enables the use of flexible substrates that cannot withstand high temperatures or vacuum conditions, and simplifies the overall manufacturing process while maintaining or improving trace quality.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of silver nanowires reduces line breaks, enhances production yield, and decreases manufacturing costs by increasing panel transmittance and bending resistance.

Implementation Method 1

forming, using a silver nanowire material, an electrically conductive pattern on a flexible substrate

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11508759B2Method of manufacturing flexible array substrate, flexible array substrate, and flexible display device
Publication Date: 2022.11.22 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US11508759B2 patent drawing
  • US11508759B2 patent drawing
  • US11508759B2 patent drawing

AI summary

A method of manufacturing a flexible array substrate, a flexible array substrate, and a flexible display device are disclosed. The method of manufacturing the flexible array substrate is implemented by using silver nanowire to form an electrically conductive pattern on a flexible substrate. In this manner, using the silver nanowire to replace metal or indium tin oxide as conventionally used to form the electrically conductive pattern can reduce trace resistance, increase panel transmittance, improve bending resistance of the flexible array substrate, avoid line breaks in products, improve production yield, and reduce manufacturing costs of products.