Fine Silver Particle Ink Low-Temperature Sintering
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Solution Overview
Problem
Existing fine silver particle inks require sintering temperatures higher than 100° C. and result in matte surfaces with high volume resistance, failing to meet the demands for low-temperature sintering and smooth surfaces for electroconductive wiring in printed wiring boards.
Innovation Solution
A fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, and fine silver particles, which is applied on a substrate by spin coating and sintered at 100° C., achieving a mirror surface and low volume resistivity of 8 to 25 μΩ·cm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional fine silver particle inks are sintered at low temperatures (around 100°C), then substrate heat resistance requirements are reduced, but the sintered bodies exhibit matte surfaces and high volume resistance
Solution Approach 1:
The patent changes the chemical composition parameters of the ink formulation by incorporating specific organic additives (hexylamine, dodecylamine, oleic acid) alongside traditional dispersants. This compositional parameter change enables the silver particles to sinter at lower temperatures while maintaining electrical conductivity, resolving the contradiction between low sintering temperature and electrical conductivity
Solution Approach 2:
The patent creates a composite ink system combining fine silver particles with multiple organic compounds (amines and carboxylic acids) that work synergistically. The composite nature of this ink formulation allows simultaneous achievement of low-temperature sintering capability and good electrical conductivity, which conventional single-component inks cannot achieve
2Temperature
If conventional fine silver particle inks are sintered at low temperatures (around 100°C), then substrate heat resistance requirements are reduced, but the sintered bodies exhibit matte surfaces
Solution Approach 1:
The patent modifies the chemical parameters of the ink system by adding specific organic compounds that influence surface morphology during sintering. These compositional changes result in smooth mirror-like surfaces even at low sintering temperatures, eliminating the matte surface problem associated with conventional low-temperature sintering
3Quantity of substance
If existing ultrafine metal particle dispersion liquids are used, then fluidity is maintained at high concentration, but sintering temperature far exceeds 100°C
Solution Approach 1:
The patent changes the chemical environment parameters by introducing a specific combination of organic additives (hexylamine, dodecylamine, oleic acid) that modify the interaction between particles and the dispersing medium. This parameter change maintains fluidity at high concentrations while simultaneously enabling low-temperature sintering, resolving the contradiction between concentration and sintering temperature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ink enables the formation of electroconductive films or wiring with low volume resistance and a mirror surface at low temperatures, suitable for substrates with low heat resistance, while maintaining a smooth surface and reducing sintering time.
Implementation Method 1
binding the fine silver particles in the coating film by sintering to obtain a thin film
Implementation Method 2
after the fine silver particle ink is applied on a substrate by spin coating
Data Source
AI summary
Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100° C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 μΩcm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.