Silver Paste Composition for Semiconductor Bonding
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Solution Overview
Problem
Conventional adhesive compositions for semiconductor devices fail to simultaneously achieve high adhesive properties, thermal conductivity, and electrical conductivity, especially when a preheating process is omitted, which is necessary for reducing manufacturing costs and ensuring operational stability.
Innovation Solution
A silver paste composition with silver particles of 0.1 μm to 20 μm diameter, a solvent with a boiling point of 300° C or more, and a sintering process at less than 300° C to form a silver sintered body with preferred flaky or spherical particles and specific solvent structures, such as ether or hydroxyl structures, for enhanced adhesive, thermal, and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive compositions are used, then the bonding process requires multiple steps including preheating, but the adhesive strength, thermal conductivity, and electrical conductivity are insufficient
Solution Approach 1:
The invention changes the physical and chemical parameters of the adhesive composition by using silver particles with specific size distribution (0.1-20 μm), high silver content (70-95 mass%), and controlled organic substance content (5-30 mass%). These parameter changes enable the adhesive to achieve sufficient adhesive strength, thermal conductivity, and electrical conductivity in a single sintering step without preheating, thus improving reliability while reducing process complexity
Solution Approach 2:
The invention uses a composite material system consisting of silver particles dispersed in a specific organic substance matrix. The composite structure allows the adhesive to simultaneously provide mechanical bonding (adhesive strength), heat dissipation (thermal conductivity), and electrical connection (electrical conductivity), resolving the contradiction by achieving multiple functions in one material system that enables single-step processing
2Productivity
If a preheating process is omitted to reduce manufacturing cost, then the number of steps is reduced, but the adhesive property becomes insufficient
Solution Approach 1:
The invention modifies the parameters of the organic substance (using specific types with controlled boiling points and molecular weights) and silver particle characteristics (size distribution, surface treatment) to enable the adhesive to maintain adequate viscosity and bonding capability directly at sintering temperature without preheating, thus achieving both high productivity and sufficient adhesive strength
Solution Approach 2:
The invention performs preliminary optimization of the adhesive composition formulation during the material design stage, selecting specific silver particle sizes (0.1-20 μm), organic substance types, and their proportions (70-95 mass% silver) in advance. This preliminary preparation ensures that the adhesive has the appropriate rheological properties and bonding characteristics ready for direct single-step sintering, eliminating the need for separate preheating steps while maintaining strong adhesive properties
3Temperature
If silver particles with high thermal conductivity are used, then thermal conductive property is improved, but the adhesive composition becomes difficult to process
Solution Approach 1:
The invention optimizes the particle size parameter of silver to a specific range (0.1-20 μm) and controls the organic substance content (5-30 mass%) to balance thermal conductivity and processability. The fine particle size ensures high thermal conductivity while the controlled organic matrix maintains adequate viscosity for dispensing and printing operations, resolving the contradiction between thermal performance and ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silver paste composition achieves high adhesive strength, sufficient thermal conductivity, and electrical conductivity in a single sintering step, reducing manufacturing costs and improving semiconductor device stability.
Implementation Method 1
a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300° C. or more
Implementation Method 2
the silver particles are sintered by application of heat at less than 300° C. so that a silver sintered body is formed
Data Source
AI summary
A silver paste composition comprising silver particles having a particle diameter of 0.1 μm to 20 μm, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300° C. or more.