Silver Paste Leakage Prevention in Electronic Device Mounting
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Solution Overview
Problem
The use of silver paste for die-bonding in electronic device manufacturing can lead to leakage and spreading, causing adhesion issues with bonding wires and potentially resulting in electrical connection failures due to the paste adhering to regions intended for wire bonding.
Innovation Solution
A method involving a mounting substrate with a conductive first region and a second region covered with resin, where the silver paste is applied on the first region, and the resin is removed after curing, preventing the paste from adhering to the second region and thus reducing the risk of electrical connection failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silver paste is applied on the first region for die-bonding, then the electronic component can be mounted, but the paste may leak and spread to the second region causing adhesion issues with bonding wires
Solution Approach 1:
The mounting substrate is divided into a first region for die-bonding and a second region for wire bonding, with a resin layer selectively covering the second region to segment the paste application area and prevent contamination
Solution Approach 2:
A resin layer is introduced as an intermediary protective layer over the second region, preventing direct contact between the silver paste and the wire bonding region, thus eliminating adhesion issues while allowing paste to be applied freely on the first region
2Reliability
If the resin covering the second region is removed after heating, then the paste adhesion to the second region is prevented, but the resin peeling process is required
Solution Approach 1:
The resin layer is applied in advance to cover the second region before paste application, and is removed after the paste has been applied and cured, performing the protective function during the critical manufacturing stages
Solution Approach 2:
The resin layer serves as a temporary protective element that is discarded after fulfilling its protective function, allowing selective removal without affecting the cured paste on the first region or the substrate structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses electrical connection failures by ensuring the silver paste does not adhere to the second region, maintaining insulation and ensuring reliable wire bonding.
Implementation Method 1
The resin peeled from the second region by the heating is removed in the removing
Implementation Method 2
The mounting step includes heating the mounting substrate to cure the metal paste with the electronic component being placed on the metal paste applied on the first region
Data Source
AI summary
A method for manufacturing an electronic component includes preparing a mounting substrate provided with a first region to mount an electronic component thereon and a second region having conductivity, covering the second region with resin, applying a metal paste on the first region, mounting the electronic component on the first region with the metal paste, and removing the resin covering the second region. The mounting includes heating the mounting substrate to cure the metal paste with the electronic components being placed on the metal paste applied on the first region. The resin peeled from the second region by the heating is removed in the removing.