Silver Paste Composition With Low-Cure Shrinkage for Semiconductor Bonding
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Solution Overview
Problem
Conventional silver pastes exhibit insufficient reliability and heat dissipation at high temperatures, making them unsuitable for bonding materials in semiconductor applications, and existing silver sintering pastes suffer from significant shrinkage during curing, leading to increased thermal resistance and reduced bonding strength.
Innovation Solution
A paste composition comprising silver particles, a thermosetting resin, a curing agent, and a solvent, with a shrinkage rate of 15% or less, which includes hollow silver particles and a flexible epoxy resin to reduce thermal resistance and enhance adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver nanoparticles with protective groups are used to achieve low temperature bonding and excellent thermal conductivity, then thermal conductivity and electric conductivity are improved, but the paste shrinks significantly in volume during curing and sintering
Solution Approach 1:
The patent changes the physical state of silver particles from solid to hollow structure, fundamentally altering the paste's shrinkage behavior. The hollow particles expand during curing to compensate for resin shrinkage, maintaining paste volume while preserving thermal conductivity through the hollow silver particle walls.
Solution Approach 2:
The patent employs hollow silver particles with controlled porosity to reduce overall paste shrinkage. The hollow structure provides internal volume that can expand during curing, compensating for the shrinkage of thermosetting resin and maintaining dimensional stability.
2Reliability
If conventional silver paste is used to achieve bonding, then bonding is achieved, but reliability and heat dissipation are insufficient at high temperatures
Solution Approach 1:
The patent creates a composite material system combining hollow silver particles with thermosetting resin and curing agents. This composite structure provides both mechanical bonding strength from the resin matrix and superior thermal conductivity from the hollow silver particles, achieving high temperature reliability.
Solution Approach 2:
The patent changes the silver particle morphology to hollow structure, which fundamentally improves heat dissipation capability while maintaining bonding reliability. The hollow structure provides better thermal pathways and reduces thermal resistance at the bonding interface.
3Volume of stationary object
If silver content is reduced to minimize shrinkage, then shrinkage rate is improved, but thermal conductivity may be compromised
Solution Approach 1:
The patent uses hollow silver particles that provide both volume expansion to reduce shrinkage and maintain thermal conductivity. The hollow structure allows the particles to occupy more space while containing less silver material, achieving low shrinkage without sacrificing thermal performance.
Solution Approach 2:
The patent changes the density and volume characteristics of silver particles by creating hollow structures. This allows reduction of silver content while maintaining or improving shrinkage performance and preserving thermal conductivity through the optimized hollow particle architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves reduced thermal resistance, improved thermal conductivity, and enhanced bonding strength by minimizing shrinkage, allowing for effective bonding even with reduced silver content and fewer voids.
Implementation Method 1
When a silver sintering paste using silver nanoparticles is heated, a resin included therein is cured and shrunk
Implementation Method 2
silver sintering pastes that allow for bonding at low temperatures and that use silver nanoparticles with excellent thermal conductivity and electric conductivity
Data Source
AI summary
This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.