Silver Conductive Paste Composition for Lower Volume Resistivity

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Solution Overview

Problem

Existing resin type conductive paste compositions with silver-based powders have high volume resistivity due to limitations in reducing resistivity beyond adjusting silver powder conditions, with prior art not addressing contributions from other components.

Innovation Solution

Incorporating an ester-based compound or an ether/amine-based compound into the resin type conductive paste composition, which contains a silver-based powder and a thermosetting or thermoplastic resin, to lower the volume resistivity of the cured product without altering the silver powder conditions, thereby reducing the volume resistivity of the conductive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If resin type conductive paste is used with silver-based powder, then the curing temperature can be kept relatively low (250°C or lower), but the volume resistivity of the cured product becomes relatively high

Engineering Contradiction:

Improvecuring temperatureVSAvoidvolume resistivity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The invention changes the chemical composition parameters of the paste by introducing specific organic compounds (carboxylic acid compounds, hydroxyl compounds, or amino compounds) to modify the interaction between silver particles and resin, thereby reducing volume resistivity without changing the curing temperature parameter

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite system by combining silver-based powder with specific organic compounds (carboxylic acid compounds, hydroxyl compounds, or amino compounds) and resin components, where the composite interaction between these materials reduces volume resistivity while maintaining low curing temperature

Inventive Principle:

Principle #40Composite materials

2Reliability

If silver powder conditions are adjusted to reduce volume resistivity, then the conductive performance improves, but the complexity of powder selection and processing increases

Engineering Contradiction:

Improvevolume resistivityVSAvoidsilver powder condition adjustment

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention introduces organic compounds (carboxylic acid compounds, hydroxyl compounds, or amino compounds) as intermediary substances that mediate between the silver powder and resin, facilitating better conductive network formation without requiring complex adjustments to silver powder specifications

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Instead of changing silver powder parameters (particle size, shape, density), the invention changes the paste composition parameters by adding specific organic compounds, thereby simplifying the overall material selection process while achieving lower volume resistivity

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11739232B2Conductive paste composition

Publication Date: 2023.08.29 KYOTO ELEX

AI summary

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.