Silver Paste Low-Temperature Sintering Resistivity Control

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Solution Overview

Problem

Existing silver pastes used for low-temperature sintering of conductive films exhibit variability in resistivity, making it difficult to achieve conductivity equivalent to bulk silver, which is a challenge for practical applications such as flexible displays and fine electronic circuits.

Innovation Solution

A silver paste containing a polyethyleneimine skeleton as a protective agent, combined with silver nanoparticles and additives like amine and amide functional groups, is used to stabilize the silver nanoparticles and achieve consistent resistivity in low-temperature sintering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional silver paste is used for low-temperature sintering, then sintering temperature is reduced, but resistivity becomes inconsistent and conductivity deteriorates

Engineering Contradiction:
Improvesintering temperatureVSAvoidresistivity consistency
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent modifies the chemical composition parameters of the silver paste by incorporating specific organic compounds with amine or amide functional groups alongside polyethyleneimine. This compositional parameter change enables the paste to achieve stable resistivity (1.5×10^-6 to 5.0×10^-6 Ω·cm) at low sintering temperatures (100-150°C), resolving the contradiction between temperature reduction and reliability maintenance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite silver paste system combining metallic silver nanoparticles with organic compounds (polyethyleneimine and amine/amide functional group compounds). This composite structure allows the organic components to control nanoparticle aggregation and sintering behavior, achieving both low-temperature processing and consistent electrical properties

Inventive Principle:
Principle #40Composite materials

2Use of energy by stationary object

If metal nanoparticles are used for fine wiring, then processing cost and energy are reduced, but conductivity equivalent to bulk silver cannot be achieved

Engineering Contradiction:
Improveprocessing energyVSAvoidconductivity
Core Design Contradiction:
Use of energy by stationary objectVSReliability

Solution Approach 1:

The patent changes the chemical environment parameters around silver nanoparticles by introducing organic compounds with specific functional groups. These parameter changes facilitate low-temperature sintering (reducing processing energy) while controlling nanoparticle aggregation to achieve conductivity within 1.5×10^-6 to 5.0×10^-6 Ω·cm, resolving the contradiction between energy reduction and conductivity maintenance

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The silver paste produces a conductive film with resistivity comparable to bulk silver, ensuring consistent conductivity and adhesion to substrates, even at low temperatures, thus addressing the variability issue and enhancing its applicability.

Implementation Method 1

fixing the metal as nanoparticles in the dispersion... by means of the strong reducing ability, coordinate bonding force, and electrostatic interaction of the polyalkyleneimine chain

Methodology Applied
Scientific EffectCoordinate bonding: Chemical Bonding

Implementation Method 2

fixing the metal as nanoparticles in the dispersion... by means of the strong reducing ability, coordinate bonding force, and electrostatic interaction of the polyalkyleneimine chain

Methodology Applied
Scientific EffectElectrostatic interaction: Electrostatics

Implementation Method 3

heating a coating film or printed matter at a low temperature of about 150° C.... conductivity equivalent to that of bulk silver can be obtained by heating a coating film or printed matter at a low temperature

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS10696852B2Silver paste, and conductive molded article obtained using same
Publication Date: 2020.06.30 DIC CORP

AI summary

A problem is to provide a silver paste which can produce, without variation in resistivity value, a conductive silver coating film exhibiting resistivity substantially equivalent to the resistance value of bulk silver in low-temperature sintering. The problem is solved by providing a silver paste including a silver nanoparticle aqueous dispersion prepared by using a compound having a polyethyleneimine skeleton as a protective agent, a compound having a functional group reactable with nitrogen atoms in the polyethyleneimine, and at least one compound selected from the group consisting of a compound having an amine functional group and a compound having an amide functional group.