Silver-Resin Bonding Composition for Pressure-Free Semiconductor Joining

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Solution Overview

Problem

Existing bonding materials for semiconductor devices and electrical/electronic components face challenges in achieving high thermal conductivity, low stress, reflow peeling resistance, and reliability due to issues such as sintering voids, substrate oxidation, and deformation under high-temperature conditions, particularly when using silver nanoparticles.

Innovation Solution

A thermosetting resin composition comprising silver fine particles, silver powder, resin particles, and a thermosetting resin, with specific particle sizes and properties to enhance thermal conductivity, reduce sintering voids, and improve adhesion, allowing for pressure-free joining and inert atmosphere compatibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If silver nanoparticles are used for joining, then thermal conductivity is improved, but sintering voids and oxidation occur requiring pressurization and heating

Engineering Contradiction:

Improvejoining reliabilityVSAvoidjoining process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the harmful elements (pressurization and heating steps) from the joining process by using silver powder with particle size of 0.01 μm or less that can self-sinter at low temperatures without requiring external pressure or high heat, thereby simplifying the joining process while maintaining reliability

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies inert atmosphere by conducting the joining process in a nitrogen or other inert gas environment, preventing oxidation of the silver powder and substrate, thereby eliminating the need for complex oxidation prevention measures while maintaining joining reliability

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Reliability

If filler content is increased to improve thermal conductivity, then thermal conductivity is improved, but reflow peeling resistance deteriorates

Engineering Contradiction:

Improvethermal conductivityVSAvoidreflow peeling resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent changes the particle size parameter of the filler from conventional larger particles to ultra-fine silver powder with particle size of 0.01 μm or less, which allows achieving high thermal conductivity with improved reflow peeling resistance due to better distribution and bonding characteristics

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite material system combining ultra-fine silver powder with specific resin components, creating a synergistic effect where the silver powder provides thermal conductivity while the resin matrix maintains structural integrity and reflow resistance

Inventive Principle:

Principle #40Composite materials

3Reliability

If silver powder is used for joining, then thermal conductivity is improved, but oxidation occurs during the joining process

Engineering Contradiction:

Improvethermal conductivityVSAvoidoxidation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

4Strength

If conventional joining methods are used, then adhesion is achieved, but adhesion strength is lost at solder melting point causing peeling

Engineering Contradiction:

Improveadhesion strengthVSAvoidheat resistance

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent replaces the mechanical adhesion system with a thermal bonding system where silver powder self-sinters at low temperatures to form strong metallurgical bonds that maintain adhesion strength even at solder melting temperatures, eliminating peeling issues

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition provides excellent thermal conductivity, low stress, and reflow peeling resistance, reducing deformation and strain in semiconductor chips, and enhancing the reliability of semiconductor devices and electrical/electronic components.

Implementation Method 1

silver fine particles which are self-sinterable at low temperatures

Methodology Applied

Scientific EffectSelf-sintering: Sintering

Implementation Method 2

resin particles provide a physical barrier to restrict sintering routes

Methodology Applied

Scientific EffectPhysical barrier effect: Physical Containment

Implementation Method 3

a material for bonding the heat dissipation member is itself required to have higher thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12606723B2Thermosetting resin composition, semiconductor device and electrical/electronic component

Publication Date: 2026.04.21 KYOCERA CORP

AI summary

There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 nm to 200 nm in thickness or in minor axis; (B) a silver powder having an average particle size of more than 0.2 μm and 30 μm or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the resin particles (C) is 0.01 to 1 part by mass and an amount of the thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B).