Silver Particle Resin Bonding for Semiconductor Heat Dissipation
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Solution Overview
Problem
Conventional bonding materials such as solders and silver pastes exhibit insufficient reliability and heat dissipation, making them unsuitable for high-temperature semiconductor applications.
Innovation Solution
A thermosetting resin composition comprising silver particles with specific size ranges and a thermosetting resin, where the silver particles are formed by aggregating primary particles, providing excellent electrical conductivity, thermal conductivity, and adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding materials such as solders and silver pastes are used, then bonding functionality is achieved, but reliability and heat dissipation are insufficient for high-temperature applications
Solution Approach 1:
The invention changes the particle size parameter of silver from conventional large particles to nanoparticles (10-100 nm), which fundamentally alters the thermal and electrical conductivity properties. This parameter change enables the bonding material to achieve excellent heat dissipation and reliability at high temperatures while maintaining low firing temperature requirements
Solution Approach 2:
The invention creates a composite material system combining silver nanoparticles with organic vehicle materials and sintering aids. This composite structure integrates the high thermal conductivity of silver with the adhesive properties of organic materials, achieving both reliable bonding and superior heat dissipation that neither material could achieve alone
2Reliability
If silver nanoparticles are used to achieve low temperature firing, then electrical conductivity is improved, but particle aggregation control becomes challenging
Solution Approach 1:
The invention introduces organic vehicle materials and sintering aids as intermediary substances that mediate between silver nanoparticles during the firing process. These intermediaries prevent uncontrolled aggregation by providing steric or electrostatic stabilization, allowing precise control of particle size distribution while maintaining the electrical conductivity benefits of nanoparticles
Solution Approach 2:
The invention precisely controls the particle size parameter within a narrow range (10-100 nm) and maintains specific surface area within 1-10 m²/g. This parameter control prevents excessive aggregation while ensuring low temperature sintering capability and high electrical conductivity, resolving the contradiction between conductivity improvement and manufacturing precision
3Temperature
If high thermal conductivity is achieved through silver particles, then heat dissipation is improved, but adhesion between bonding material and substrate may be compromised
Solution Approach 1:
The invention creates a composite bonding material where silver nanoparticles provide thermal conductivity while organic vehicle materials and sintering aids provide adhesion functionality. This composite structure allows the material to simultaneously achieve high heat dissipation capability and strong bonding strength, resolving the contradiction between thermal performance and adhesive performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high thermal conductivity, low thermal resistance, and improved adhesion, enhancing the reliability and heat dissipation of semiconductor devices and electronic components.
Implementation Method 1
obtaining a silver particle-containing slurry by reducing, with a reducing compound, a silver ammine complex contained in the obtained silver ammine complex solution
Implementation Method 2
silver particles including secondary particles having an average particle size from 0.5 to 5.0 μm, the secondary particles being formed by aggregation of primary particles having an average particle size from 10 to 100 nm
Implementation Method 3
The composition achieves high thermal conductivity, low thermal resistance, and improved adhesion, enhancing the reliability and heat dissipation of semiconductor devices and electronic components
Data Source
AI summary
Provided is a thermosetting resin composition containing: (A) silver particles including secondary particles having an average particle size from 0.5 to 5.0 μm, the secondary particles being formed by aggregation of primary particles having an average particle size from 10 to 100 nm; and (B) a thermosetting resin.