Silver Sinter Composition for Low-Temperature Conductive Bonding
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Solution Overview
Problem
Conventional silver sinter materials require high temperatures and pressures for sintering, are not compatible with certain substrates, and often compromise electrical and thermal conductivities, especially when adhering to semiconductors, oxides, and plastics without special pre-treatments.
Innovation Solution
A composition comprising a deoxidizer solvent, a co-solvent, and silver particles, which allows for sintering at temperatures below 200°C without oxygen or high pressure, using a deoxidizer solvent to reduce silver oxide and a co-solvent to facilitate silver particle bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional silver sinter materials are used, then high electrical and thermal conductivities are achieved, but high sintering temperatures and pressures are required
Solution Approach 1:
The patent changes the chemical composition parameters of the sintering paste by incorporating specific organic compounds that decompose at low temperatures to generate reducing气氛, enabling silver particle sintering at temperatures below 200°C while maintaining high electrical conductivity of at least 1.0×10^5 S/cm
Solution Approach 2:
The patent uses a composite paste formulation containing silver particles, organic deoxidizer solvents, and co-solvents that work together to achieve low-temperature sintering. The composite material structure allows decomposition of organic components to create reducing conditions necessary for silver bonding at low temperatures
2Reliability
If conventional silver sinter materials are used, then high electrical and thermal conductivities are achieved, but high pressure is required
Solution Approach 1:
The patent changes the pressure parameter by using chemically active organic compounds that decompose to create reducing气氛, replacing the need for high mechanical pressure (typically 5-10 MPa) with chemical reactions that occur at atmospheric or low pressure conditions during sintering
Solution Approach 2:
The patent replaces the mechanical pressure system with a chemical reaction system. Instead of applying high pressure to force silver particles together, the organic deoxidizer solvents chemically decompose to create reducing conditions that enable silver particle bonding at low pressure through in-situ generated hydrogen or other reducing species
3Temperature
If reducing atmospheres are used for sintering, then low temperature sintering is achieved, but complex manufacturing conditions are required
Solution Approach 1:
The patent implements self-service by incorporating the reducing agent functionality directly into the sintering paste formulation itself. The organic deoxidizer solvents and co-solvents in the paste decompose during heating to generate the reducing气氛 in-situ, eliminating the need for external reducing atmosphere control systems or complex furnace atmosphere management
Solution Approach 2:
The organic compounds in the paste serve multiple functions: they act as binders holding the silver particles together, as deoxidizers removing surface oxides from silver particles, and as sources of reducing气氛 for low-temperature sintering. This multi-functionality simplifies the overall manufacturing process by consolidating multiple requirements into a single paste formulation
4Strength
If pure sintered silver films are used, then good adhesion to noble metals is achieved, but adhesion to semiconductors and plastics is poor
Solution Approach 1:
The patent changes the surface chemistry parameters by incorporating organic compounds with functional groups that can bond to both silver particles and diverse substrates including semiconductors and plastics. These modified surface properties enable universal adhesion while maintaining the metallic conductivity of the silver network
Solution Approach 2:
The patent uses a composite paste containing silver particles combined with organic deoxidizer solvents and co-solvents that provide adhesion-promoting functional groups. This composite structure enables the sintered film to adhere to multiple substrate types (semiconductors, plastics, metals) while maintaining high electrical conductivity through the silver particle network
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves electrical conductivity of at least 1.0×105 S/cm and thermal conductivity of at least 75 W/mK, with improved adhesion to various surfaces, including Cu and Al interconnects, without the need for reducing atmospheres or high pressures.
Implementation Method 1
the deoxidizer solvent comprises one or more compounds of the formula CnOmH2n+2−p(OH)p... the deoxidizer solvent to reduce silver oxide
Implementation Method 2
allows for sintering at temperatures below 200°C... a co-solvent to facilitate silver particle bonding
Data Source
AI summary
There is provided a composition comprising a deoxidizer solvent, a co-solvent and a plurality of silver particles suspended in a mixture of the deoxidizer solvent and the co-solvent, wherein the deoxidizer solvent comprises one or more compounds of the formula CnOmH2n+2−p(OH)p, where n, m and p are integers, with the proviso that 1≤(n+m)/p≤8, and wherein the mixture of the deoxidizer solvent and the co-solvent comprises hydroxyl groups at a concentration in the range of 2 M to 20 M. There is also provided a method of forming the composition. There are also provided a method of forming a composition material and a device comprising N the composite material.