High-Temperature RFID Tag Using Silver Solder
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Solution Overview
Problem
Conventional RFID tags are not suitable for high-temperature applications as they lose flexibility and experience electrical failure due to reflow of lead-based solder, while ceramic tags are rigid and cannot withstand physical flexing, limiting their use in flexible and high-temperature environments.
Innovation Solution
A flexible high-temperature-tolerant RFID tag is developed using a SOT-packaged integrated circuit attached to a flex circuit with high-temperature silver solder, encapsulated in a flexible material like rubber, allowing it to maintain flexibility and electrical integrity even at elevated temperatures, suitable for applications such as molded products and personal protective equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional RFID tags use lead-based solder, then ease of manufacture is improved, but reliability deteriorates at high temperatures due to solder reflow
Solution Approach 1:
The patent changes the temperature parameter threshold by using high-temperature silver solder instead of lead-based solder. The silver solder remains stable at temperatures above 450°C, preventing reflow and maintaining electrical integrity in high-temperature environments while still being manufacturable through standard high-temperature soldering processes.
Solution Approach 2:
The patent creates a composite structure combining silver solder material with the RFID tag assembly. This composite approach uses silver solder specifically for its high-temperature stability properties, creating a joint that withstands temperatures exceeding 450°C without reflow, thus resolving the contradiction between ease of manufacture and high-temperature reliability.
2Adaptability or versatility
If RFID tags use flexible substrates, then adaptability is improved, but reliability deteriorates at high temperatures due to loss of flexibility and electrical failure
Solution Approach 1:
The patent changes the temperature parameter threshold by using high-temperature silver solder instead of lead-based solder. The silver solder remains stable at temperatures above 450°C, preventing reflow and maintaining electrical integrity in high-temperature environments while still being manufacturable through standard high-temperature soldering processes.
Solution Approach 2:
The patent creates a composite structure combining silver solder material with the RFID tag assembly. This composite approach uses silver solder specifically for its high-temperature stability properties, creating a joint that withstands temperatures exceeding 450°C without reflow, thus resolving the contradiction between ease of manufacture and high-temperature reliability.
3Reliability
If ceramic RFID tags are used, then reliability is improved at high temperatures, but adaptability deteriorates due to rigidity and inability to withstand physical flexing
Solution Approach 1:
The patent employs a flexible substrate structure with thin-film construction that can bend and flex without damage. This flexible shell approach allows the RFID tag to adapt to flexible surfaces and withstand physical deformation while maintaining electrical integrity, contrasting with rigid ceramic tags.
Solution Approach 2:
The patent creates a composite structure combining silver solder material with the RFID tag assembly. This composite approach uses silver solder specifically for its high-temperature stability properties, creating a joint that withstands temperatures exceeding 450°C without reflow, thus resolving the contradiction between ease of manufacture and high-temperature reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables RFID tags to withstand high temperatures and maintain flexibility, preventing electrical failure and allowing their use in applications that would otherwise damage standard RFID tags, such as in high-temperature molding processes and flexible products like gloves and ski boots.
Implementation Method 1
attached with a high temperature solder to a flex circuit
Implementation Method 2
the SOT packaged RFID integrated circuit may be encapsulated in rubber
Data Source
AI summary
Apparatus and associated methods relate to a flexible high-temperature-tolerant RFID tag having an RFID integrated packaged in an SOT package attached with a high temperature solder to a flex circuit defining an RFID antenna. In an illustrative embodiment, the flexible high-temperature-tolerant RFID tag may be encapsulated in a flexible material. For example, the SOT packaged RFID integrated circuit may be encapsulated in rubber. In some embodiments the entire assembled RFID tag may be encapsulated in rubber or another flexible compound. In some embodiments, such flexible high-temperature-tolerant RFID tags may be advantageously used in high-temperature applications. In an exemplary embodiment, flexible high-temperature-tolerant RFID tags may be attached to products that may be flexible and/or deformable. In an exemplary embodiment, a flexible high-temperature-tolerant RFID tag may be molded into a rubber that will be used in a flexible application.