SIM Card Antenna Gain Stability via 3D Vertical Shift
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Solution Overview
Problem
SIM cards with antennas arranged along the surface direction of the base member experience significant gain changes, especially when in contact with metal surfaces, leading to decreased performance in communication applications.
Innovation Solution
A SIM card IC module with a loop antenna arranged parallel to the mounting surface and shifted along the thickness direction of the board, utilizing a three-dimensional structure and conductor connections through holes to minimize gain changes and enhance communication accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the antenna is arranged along the surface direction of the base member, then the SIM card can be used in both contact and non-contact types, but the antenna gain changes significantly when in contact with metal surfaces
Solution Approach 1:
The patent transitions the antenna arrangement from a two-dimensional surface layout to a three-dimensional structure by positioning the antenna vertically along the thickness direction of the base member. This dimensional change allows the antenna to maintain stable gain characteristics when in contact with metal surfaces, as the vertical orientation reduces interaction with horizontal metal surfaces compared to surface-parallel arrangements.
2Device complexity
If the antenna is arranged along the surface direction of the base member, then the SIM card structure is simple, but the gain is greatly decreased by reverse current excited on metal surfaces
Solution Approach 1:
The patent employs a three-dimensional antenna arrangement positioned vertically along the thickness direction of the base member. This vertical positioning in the third dimension (thickness direction) reduces the antenna's interaction with metal surfaces in the horizontal plane, thereby minimizing reverse current effects while maintaining structural simplicity.
3Reliability
If the antenna is arranged parallel to the mounting surface and shifted along the thickness direction, then the antenna gain change is suppressed, but the antenna structure becomes more complex
Solution Approach 1:
The patent implements a three-dimensional antenna structure positioned vertically along the thickness direction of the base member. This vertical arrangement in the third dimension achieves stable gain characteristics by reducing interaction with metal surfaces, while the overall SIM card structure remains relatively simple through integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses antenna gain changes, ensuring consistent communication performance even when the SIM card is in contact with metal surfaces, and allows for increased communication distance by connecting to external antennas, while simplifying configuration and design flexibility.
Implementation Method 1
an antenna connected to the circuit section... the antenna is arranged to be parallel to the mounting surface and arranged at a position shifted from the mounting surface by a predetermined dimension along a thickness direction of the board
Data Source
AI summary
The invention provides a SIM card IC module and a SIM card having a small antenna gain change. A SIM card 10 includes an IC module 11 including a circuit section 18 having a plurality of electronic components 16 mounted on a mounting surface 14A of a board 14, and an antenna 20 connected to the circuit section 18, and a plate-like base member 12 in which a recessed portion 22 for accommodating the circuit section 18 is provided. The antenna 20 is arranged to be substantially parallel to the mounting surface 14A, and has a three-dimensional structure arranged at a position shifted by a predetermined dimension from the mounting surface 14A along a thickness direction of the board 14.