SIM Module Discontinuity Channel for Stress-Free Detachment

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing SIM module manufacturing process faces challenges with asymmetrical pre-cut lines causing stress and bending issues during detachment, leading to potential damage and increased production costs due to mechanical processes and difficulty in detecting errors.

Innovation Solution

A SIM module with a discontinuity channel formed around the SIM, featuring two points of attachment on the plastic support that are easily broken without applying strong forces, eliminating the need for pre-cut lines and allowing for precise detachment without stress on electrical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If pre-cut lines are used to facilitate detachment, then the SIM can be detached from the plastic support, but asymmetrical pre-cut lines cause stress and bending issues during detachment

Engineering Contradiction:
ImprovedetachmentVSAvoidstress distribution
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The plastic support is segmented into multiple attachment points (at least two points) distributed around the SIM card perimeter. This segmentation allows the detachment force to be distributed across multiple locations rather than concentrated at a single pre-cut line, preventing asymmetrical stress distribution and bending while maintaining easy detachability.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If pre-cut lines are formed by mechanical blade process, then the SIM can be detached, but the production is frequently impacted from blade stopping due to powder or loss of lubrication

Engineering Contradiction:
Improvepre-cut line formationVSAvoidproduction continuity
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The mechanical blade cutting process is replaced with a punching process that creates holes or recesses in the plastic support. This substitution eliminates the issues of blade stopping, powder generation, and lubrication loss, while still achieving the desired detachment function through the punched features that allow easy separation of the SIM card.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If multiple process steps are used for pre-cut lines, then the SIM can be detached, but the manufacturing cost increases

Engineering Contradiction:
ImprovedetachmentVSAvoidmanufacturing process steps
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The attachment points are formed in a single punching process step rather than requiring separate pre-cut line formation steps. This merging of operations reduces the total number of manufacturing steps, lowers production complexity and cost, while still providing multiple attachment points for easy SIM card detachment.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If pre-cut lines are formed asymmetrically, then the manufacturing process is simpler, but the asymmetrical pre-cut lines cause overbalanced stress distribution and local bending

Engineering Contradiction:
Improvepre-cut line formationVSAvoidstress distribution
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The attachment points are strategically positioned at specific locations around the SIM card perimeter where they provide optimal stress distribution. By carefully selecting the positions of at least two attachment points, the design ensures balanced stress distribution during detachment while maintaining manufacturing simplicity through the punching process.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS9487343B2SIM module
Publication Date: 2016.11.08 STMICROELECTRONICS SRL
  • US9487343B2 patent drawing
  • US9487343B2 patent drawing
  • US9487343B2 patent drawing

AI summary

A SIM module includes a SIM and a plastic support on which the SIM is attached. A discontinuity channel between the plastic support and the SIM is formed all around the SIM, the discontinuity channel being interrupted in at least two points of the plastic support attaching the SIM to the plastic support. The points are on a short side and on a long side of the SIM.