SIM Module Shock Resistance via Angled Substrate
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Solution Overview
Problem
Existing portable subscriber identification modules for wireless transceivers lack reliability in withstanding shock, vibration, and thermal stress, which affects their performance and durability.
Innovation Solution
A portable electrical assembly with a housing having a recess, a dielectric connector portion, and a substrate with angled conductive traces, securely mounting a subscriber identification module, and providing vibration dampening and environmental protection using a dielectric spacer and seal, ensuring reliable electrical connections and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a subscriber identification module is mounted in a portable device, then unique identification and network service assignment are enabled, but the module becomes vulnerable to shock, vibration, and thermal stress
Solution Approach 1:
The patent applies beforehand cushioning by incorporating a vibration dampening element between the substrate and the housing before assembly. This element is specifically designed to absorb shock and vibration forces that will occur during portable device operation, protecting the SIM module from mechanical stress before the stress occurs.
Solution Approach 2:
The patent employs composite materials by combining the substrate (for electrical connections), vibration dampening element (for mechanical protection), and housing (for structural support and environmental sealing). This multi-material composite structure addresses both electrical functionality and mechanical protection requirements simultaneously.
2Stability of the object's composition
If the subscriber identification module is securely mounted to provide mechanical stability, then connection reliability improves, but thermal stress from environmental exposure increases
Solution Approach 1:
The vibration dampening element serves dual functionality: it provides mechanical stability through secure mounting while simultaneously acting as a thermal buffer. The material properties of this element allow it to absorb thermal stress and prevent direct thermal transfer to the SIM module during environmental exposure.
Solution Approach 2:
The vibration dampening element acts as an intermediary between the external environment (housing) and the SIM module. It mediates thermal stress by providing thermal insulation and buffering, preventing direct thermal contact while maintaining mechanical stability.
3Ease of operation
If the subscriber identification module is exposed for easy access, then ease of operation improves, but environmental protection and data integrity deteriorate
Solution Approach 1:
The SIM module is nested within the housing structure with the substrate and vibration dampening element providing layers of protection. This nested configuration allows the module to be accessible through the housing opening while remaining protected from environmental factors by the surrounding structural elements.
Solution Approach 2:
The housing structure acts as an intermediary barrier between the external environment and the SIM module. It provides environmental protection (dust, moisture, contaminants) while maintaining controlled access to the module through designated openings or removable sections.
Data Source
AI summary
In accordance with one embodiment, an electrical assembly comprises a housing having a recess in the housing. A first connector portion is securable to the housing. The connector portion comprises a dielectric body and connector terminals. A subscriber identification module is located in or mounted in the housing and has device terminals. A substrate comprises a first section that intersects at an angle a second section. The first section comprises first conductive traces electrically connected to the device terminals. The second section comprises second conductive traces electrically connected to the connector terminals. Conductors are electrically connected to the first conductive traces and the second conductive traces.