SIM Module Assembly Vibration Damping via Protective Filler
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Solution Overview
Problem
Existing portable subscriber identification modules for wireless devices lack reliability in withstanding shock, vibration, and thermal stress, which can lead to mechanical and environmental damage.
Innovation Solution
A portable assembly with a housing that securely mounts a subscriber identification module, using a dielectric body connector and flexible substrate to connect terminals, and a protective filler to dampen vibrations and provide thermal protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a SIM module is installed in a wireless device, then unique subscriber identification and network service association are achieved, but the module becomes vulnerable to shock, vibration, and thermal stress
Solution Approach 1:
The patent applies beforehand cushioning by placing a vibration dampening material between the SIM module and the circuit board before assembly. This material is positioned in advance to absorb and dampen vibrations and shocks that may occur during device operation, protecting the SIM module from mechanical stress before it can cause damage
Solution Approach 2:
The patent uses an intermediary approach by introducing a protective layer or material between the SIM module and the external environment (vibrations, shocks, thermal stress). This intermediary layer acts as a buffer that isolates the SIM module from harmful factors while still allowing the module to function properly
2Reliability
If rigid connectors are used to connect SIM module terminals, then electrical connection is achieved, but the connection becomes susceptible to damage from mechanical stress
Solution Approach 1:
The patent applies flexible shells and thin films by using a flexible printed circuit board (FPC) instead of rigid connectors to connect the SIM module terminals. The FPC can bend and deform elastically under mechanical stress, absorbing shock and vibration while maintaining electrical connection, thus resolving the contradiction between electrical connectivity and mechanical strength
3Ease of operation
If the SIM module is exposed to the environment for ease of access, then insertion and removal are simplified, but the module is directly exposed to harmful environmental conditions
Solution Approach 1:
The patent applies nested doll by placing the SIM module within a protective cavity or recess in the circuit board assembly. This nested structure allows the SIM to be accessed through an opening while being physically protected by the surrounding board structure, providing both ease of access and environmental protection simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly ensures reliable operation by protecting the SIM from mechanical and environmental stress, maintaining signal transmission and user data integrity while allowing for movement to reduce vibration impact.
Implementation Method 1
protected by a protective filler that dampens vibrations
Implementation Method 2
protective filler that dampens vibrations and provides thermal dissipation
Data Source
AI summary
The assembly has a subscriber identification module comprising a housing with a recess disposed in the housing. An electrical connector portion is secured to the housing. The connector portion comprises a dielectric body and connector terminals. A subscriber identification module is housed in the housing, where the subscriber identification module has device terminals. A conductor or flexible substrate electrically connects the connector terminals to the device terminals. A protective filler overlies the subscriber identification module and at least part of the conductor or the flexible substrate.