Simplified SiP Structure Eliminating Discrete Interposers and Solder Balls
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Solution Overview
Problem
Traditional system in package (SiP) designs are bulky due to the use of discrete solder balls, interposers, package substrates, system boards, and underfills, which hinder the development of smaller, lighter, and thinner consumer products.
Innovation Solution
A simplified SiP structure is developed without using solder balls, interposers, package substrates, or underfills, integrating redistribution layers (RDLs) according to IC and PCB design rules, with molding material encapsulating chips and RDLs to create an extremely thin package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional SiP design uses discrete solder balls, interposers, package substrates, and underfills, then electrical connection and component joining are achieved, but the system becomes bulky and complex
Solution Approach 1:
The patent merges multiple discrete components (solder balls, interposer, package substrate, underfill) into a single integrated package substrate structure. The package substrate directly provides both mechanical support and electrical connection functions, eliminating the need for separate interposers and solder ball arrays, thus reducing structural complexity while maintaining connection reliability through integrated design
Solution Approach 2:
The invention extracts and removes unnecessary discrete components (solder balls, interposer, underfill) from the traditional SiP architecture. By taking out these redundant elements and consolidating their functions into the package substrate itself, the system achieves simpler structure without compromising electrical connection reliability
2Reliability
If multiple discrete components are used for joining, then electrical connections are established, but the overall system size increases
Solution Approach 1:
The patent combines the functions of multiple discrete components into a single package substrate that provides both mechanical support and electrical connection. This merging eliminates the need for separate interposers, solder ball arrays, and underfill materials, significantly reducing the overall package volume while maintaining reliable component joining through the integrated substrate design
3Reliability
If traditional SiP structure with multiple layers is used, then electrical connections are achieved, but the package thickness increases
Solution Approach 1:
The invention removes redundant intermediate layers (interposer, discrete solder ball layers, underfill) from the traditional multi-layer SiP structure. By taking out these unnecessary layers and consolidating electrical connection functions into the package substrate itself, the package thickness is significantly reduced while maintaining reliable electrical connections through direct mounting of chips to the substrate
Data Source
AI summary
An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. At least one chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material. A plurality of first inverse T-shaped metals of the first redistribution circuitry are electrically coupled to the at least one chip; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A plurality of second inverse T-shaped metals of the second redistribution circuitry are electrically coupled to the first redistribution circuitry. Either the first redistribution circuitry or the second redistribution circuitry has at least a first extension extended beyond a corresponding side surface of the molding material to electrically couple to at least one device.