Wafer Inspection Optical Modes Tuned by IC Layout Simulation
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Solution Overview
Problem
Current wafer inspection systems require repetitive and time-consuming tuning of optical parameters to detect defects, especially since there are numerous possible combinations of optical parameter values, and these settings may become ineffective due to changes in fabrication process conditions.
Innovation Solution
The method optimizes optical parameters through simulation rather than real wafer inspections, using a 3D model of the IC design layout to identify areas of interest, generating simulated optical images with candidate optical modes, and selecting the best mode for defect detection, with mechanisms for retraining parameters when process conditions change.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If repetitive inspections of real defects on real wafers are performed to optimize optical parameters, then the inspection accuracy is improved, but the inspection time and efficiency deteriorate
Solution Approach 1:
The patent creates virtual copies of wafers and defects through 3D modeling and simulation. Instead of repeatedly inspecting real wafers, the system generates virtual wafer models with embedded defect models and uses optical simulation to predict inspection outcomes. This copying approach maintains measurement precision while eliminating the time cost of physical inspection iterations.
Solution Approach 2:
The system performs preliminary optimization actions by simulating optical parameter effects on virtual defects before actual inspection. The defect model and optical simulation engine evaluate potential optical parameter combinations in advance, identifying optimal settings without requiring repetitive real-world inspections. This preliminary action resolves the contradiction by preparing optimal parameters computationally before physical inspection occurs.
2Reliability
If multiple optical parameter combinations are tested to achieve optimal defect detection, then the detection capability is improved, but the complexity and time consumption increase
Solution Approach 1:
The patent introduces an intermediary simulation engine that mediates between optical parameters and defect detection outcomes. Instead of directly testing multiple parameter combinations on real wafers, the simulation engine acts as an intermediary, computationally evaluating how different optical parameters would affect defect visibility. This intermediary layer simplifies the complexity by providing a virtual testing environment that predicts real-world performance without physical complexity.
Solution Approach 2:
The system systematically changes optical parameters in the simulation environment to evaluate their impact on defect detection. The optical simulation engine varies parameters such as wavelength, numerical aperture, and polarization in virtual settings, allowing comprehensive evaluation of detection capability across multiple parameter combinations without the complexity of physical reconfiguration. This parameter exploration in silico maintains high detection capability while reducing operational complexity.
3Measurement precision
If optical parameters are optimized for specific defect types, then the detection precision for those defects is improved, but the adaptability to other defect types or process conditions deteriorates
Solution Approach 1:
The patent creates a universal optimization framework where a single simulation engine can evaluate optical parameters across multiple defect types and process conditions. The system models various defect categories (particles, pattern defects, overlay errors) and fabrication variations within the same virtual environment, allowing the identification of optical parameter sets that maintain precision across diverse scenarios. This multi-functional simulation approach resolves the contradiction by enabling one system to serve multiple inspection needs simultaneously.
Solution Approach 2:
The system dynamically adapts the simulation models to reflect changing process conditions and defect types. Rather than static optimization for a single defect category, the simulation engine can reconfigure virtual defect models and process parameters to match current inspection needs. This dynamic modeling capability maintains detection precision while improving adaptability, as the simulation environment can be rapidly reconfigured without physical system changes.
Data Source
AI summary
According to some embodiments, the present disclosure provides a method for determining wafer inspection parameters. The method includes identifying an area of interest in an IC design layout, performing an inspection simulation on the area of interest by generating a plurality of simulated optical images from the area of interest using a plurality of optical modes, and selecting, based on the simulated optical images, at least one of the optical modes to use for inspecting an area of a wafer that is fabricated based on the area of interest in the IC design layout.


