Simulated Reference Bitmap for PCB Dot-Pattern Inspection
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Solution Overview
Problem
In PCB manufacturing, inkjet printers often produce errors due to nozzle malfunctions and surface contaminants, leading to distortions and misalignment in printed patterns, which can result in costly manufacturing defects.
Innovation Solution
A system generates a simulated reference bitmap image based on user-input parameters and dot-pattern images, allowing for the identification and correction of printing errors by mapping dot patterns onto the reference image and applying smoothing filters to enhance edge and intensity accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dot-pattern image is printed by an inkjet printer, then the PCB pattern can be applied to the substrate, but nozzle malfunctions and surface contaminants cause printing errors and distortions
Solution Approach 1:
The system performs preliminary inspection by capturing an image of the printed dot-pattern and comparing it against expected patterns before proceeding to manufacturing. This allows detection of nozzle malfunctions and printing errors early in the process, preventing defective patterns from being used in subsequent PCB manufacturing steps.
Solution Approach 2:
The system implements feedback by analyzing the captured dot-pattern image to identify printing errors, nozzle malfunctions, and distortions. This feedback information is then used to alert operators or adjust printing parameters, ensuring consistent printing quality and enabling corrective action before manufacturing defects occur.
2Stability of the object's composition
If the printed pattern is cured by baking, then the PCB substrate is prepared for manufacturing, but surface contaminants and curing cause distortion and misalignment of printed features
Solution Approach 1:
The system performs preliminary inspection of the dot-pattern image before the curing process. By detecting potential distortions, misalignments, or contamination issues before baking, the system can identify problems that would be exacerbated by curing, allowing for corrective action to maintain pattern stability and alignment.
Solution Approach 2:
The inspection system provides feedback on pattern quality before curing occurs. This feedback mechanism allows operators to address alignment issues or contamination problems before the curing process sets the pattern, preventing permanent distortions and ensuring manufacturing precision is maintained through the curing step.
3Reliability
If inspection is performed on printed images, then printing errors can be identified, but the inspection process itself adds time and complexity to manufacturing
Solution Approach 1:
The system creates a digital copy (image) of the printed dot-pattern and performs inspection on this copy rather than requiring complex physical measurement devices. This approach simplifies the inspection system while maintaining high error detection capability, as standard imaging and image processing techniques can be used to identify printing errors, nozzle malfunctions, and pattern distortions.
Data Source
AI summary
Embodiments of the present invention enable generation of a simulated reference bitmap image that corresponds to a dot-pattern image. Certain applications of the present invention are its use in various embodiments of a system for inspection of a printed circuit board (“PCB”) substrate. In embodiments, a dot-pattern image and user-input configuration parameters are used to create an initialized simulated reference bitmap, and the dot pattern is mapped onto the reference bitmap using a scaling factor. In embodiments, reference bitmaps of individual sections of a dot-pattern image may be generated separately.