Simultaneous Delamination and Adhesion Curved Head
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Solution Overview
Problem
Conventional methods for manufacturing flexible display devices require separate delamination and adhesion processes, leading to increased process time, reduced yield, and deformation due to residual stress.
Innovation Solution
An apparatus and method for simultaneously performing delamination and adhesion processes using a lower stage to fix a carrier substrate and an upper stage with a curved main body to suction and fix a second workpiece, allowing for sequential contact and adhesion to a first workpiece while delaminating from the carrier substrate, with adjustable suction forces and hole configurations to manage pressure and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If delamination and adhesion processes are performed separately, then each process can be optimized independently, but the number of required processes increases and process time becomes longer
Solution Approach 1:
The patent merges the delamination process and adhesion process into a single integrated operation. The delamination unit separates the first workpiece from the carrier substrate while the adhesion unit simultaneously bonds the first workpiece to the second workpiece, reducing the total number of process steps and overall processing time.
Solution Approach 2:
The apparatus performs multiple functions (delamination and adhesion) within a single integrated system. The processing head contains both delamination functionality for separating workpieces from carriers and adhesion functionality for bonding workpieces together, enabling one device to execute multiple manufacturing operations.
2Reliability
If delamination and adhesion processes are performed separately, then process control is simpler, but yield decreases due to multiple handling steps
Solution Approach 1:
By combining delamination and adhesion into a single simultaneous operation, the patent eliminates intermediate handling steps between these processes. The workpiece transitions directly from being delaminated to being adhered without separate process interruptions, reducing the risk of defects and improving yield.
3Manufacturing precision
If separate delamination and adhesion processes are used, then residual stress can be managed in each process, but workpiece deformation increases due to cumulative stress
Solution Approach 1:
The patent combines delamination and adhesion processes to occur simultaneously in a single operation. By performing both processes at the same time rather than sequentially, the cumulative residual stress that causes workpiece deformation is reduced, while the overall process time is shortened.
4Manufacturing precision
If a curved main body is used to suction and fix workpieces, then adhesion uniformity improves, but device complexity increases
Solution Approach 1:
The patent employs a curved main body structure in the processing head that uses suction forces to hold and position workpieces. The curved geometry helps distribute suction forces more uniformly across the workpiece surface, improving adhesion uniformity during the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of processes and time required, increases yield, and minimizes workpiece deformation by managing residual stress through simultaneous adhesion and delamination.
Implementation Method 1
a lower stage 100 configured to suction and fix a carrier substrate 300 on which a first workpiece 400 is adhered
Data Source
AI summary
The present invention relates to an apparatus and a method for simultaneously performing delamination and adhesion processes. The apparatus which simultaneously performs delamination and adhesion processes includes: a lower stage configured to suction and fix a carrier substrate on which a first workpiece is adhered; and an upper stage including a curved main body configured to suction and fix a second workpiece and formed in a shape convex toward the first workpiece, and a driving portion configured to rotate the curved main body such that predetermined portions of the second workpiece sequentially come into contact with corresponding predetermined portions of the first workpiece at a predetermined pressure, adhere the second workpiece to the first workpiece, and delaminate the first workpiece from the carrier substrate during an adhesion process. According to the present invention, the required number of detailed processes and a process time are decreased, a yield is increased, and deformation of a workpiece due to a residual stress generated during the adhesion and delamination processes is minimized by the adhesion and delamination processes being performed simultaneously.