Simultaneous Substrate Transfer Device for Semiconductor Bonding
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Solution Overview
Problem
The existing bonding systems for semiconductor devices are inefficient in transferring substrates due to the sequential handling of first and second substrates, leading to prolonged processing times.
Innovation Solution
A bonding system is designed with a substrate transfer device that simultaneously holds and transfers first and second substrates from their respective holding plates, allowing for concurrent processing and bonding, thereby reducing the overall processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If substrates are transferred one at a time sequentially, then the transfer device structure is simple, but the processing time is prolonged
Solution Approach 1:
The patent combines multiple substrate transfer operations into a single concurrent operation. The transfer device is configured to hold and transfer multiple substrates (first substrate and second substrate) simultaneously in one operation, rather than transferring them sequentially. This merging of transfer operations directly reduces the total processing time while the integrated holding plate design keeps the structural complexity manageable.
Solution Approach 2:
The patent introduces a vertical stacking dimension to the transfer process. Multiple substrates are arranged in different vertical layers on the holding plate, with the first substrate held on an upper surface and the second substrate held on a lower surface. This three-dimensional arrangement allows concurrent transfer of multiple substrates without significantly increasing the horizontal footprint or mechanical complexity of the transfer device.
2Productivity
If substrates are transferred simultaneously, then the processing time is shortened, but the transfer device structure becomes more complex
Solution Approach 1:
The transfer device merges the functionality of multiple single-substrate holders into a single integrated holding plate structure. This holding plate can simultaneously support and transfer multiple substrates in different vertical positions, enabling concurrent processing that improves productivity while avoiding the need for multiple separate transfer mechanisms.
Solution Approach 2:
The holding plate is designed as a universal component that can hold and transfer different types of substrates (first substrate and second substrate) simultaneously. This multi-functional design allows the same structural element to perform multiple transfer operations that would otherwise require separate dedicated devices, thereby improving productivity without proportionally increasing device complexity.
Data Source
AI summary
A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.