Single Anisotropic Conductive Film for LCD Circuit Bonding

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Solution Overview

Problem

Conventional liquid crystal display panels require different types of anisotropic conductive films for fixing the driving circuit and flexible wiring board, leading to increased workloads and material costs due to varying conditions such as pressure-bonding temperature and time, as well as the need for additional resin application.

Innovation Solution

Using a single anisotropic conductive film for both the driving circuit and flexible wiring board, applied across the entire substrate except for the display portion, and hardened through pressure and heating, eliminating the need for separate films and resin application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If different types of anisotropic conductive films are used for fixing the driving circuit and flexible wiring board, then the electrical and mechanical connections are reliable, but the workloads and material costs increase due to varying pressure-bonding conditions

Engineering Contradiction:

Improveelectrical and mechanical connectionsVSAvoidworkloads

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent applies universality by using a single type of anisotropic conductive film to fix both the driving circuit and flexible wiring board, replacing the conventional approach of using different film types (ACF1 for driving circuit, ACF2 for flexible wiring board). This multi-functional film eliminates the need for separate bonding processes and reduces operational complexity while maintaining reliable connections.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the bonding processes by combining the fixation of the driving circuit and flexible wiring board into a single operational sequence using one anisotropic conductive film type. This consolidation eliminates the need to switch between different films and their respective bonding conditions, thereby reducing workloads and improving productivity.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

Engineering Contradiction:

Improveelectrical and mechanical connectionsVSAvoidmaterial costs

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The patent reduces material costs by using a single type of anisotropic conductive film for both the driving circuit and flexible wiring board fixation, eliminating the need to purchase and manage multiple film types (ACF1 and ACF2). This universal film approach maintains reliable electrical and mechanical connections while reducing material inventory and purchasing costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If multiple types of anisotropic conductive films are used, then specific bonding conditions can be optimized for each component, but the process complexity and time to change film types increase

Engineering Contradiction:

Improvebonding conditions optimizationVSAvoidtime to change film types

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent eliminates the time loss associated with changing film types by using a single universal anisotropic conductive film for all bonding operations. This universal film maintains the ability to optimize bonding conditions while removing the operational delays and complexity of switching between different film types during the manufacturing process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces workloads and material costs by streamlining the fixing process and eliminating the need for additional resin application, while ensuring reliable electrical and mechanical connections.

Implementation Method 1

an anisotropic conductive film for driving circuit in a portion of the first substrate other than a display portion... an anisotropic conductive film for flexible wiring board at an end of the portion other than the display portion

Methodology Applied

Scientific EffectAnisotropic conduction: Conduction (electrical)

Implementation Method 2

the conditions, of use (e.g., a pressure-bonding temperature and a pressure-bonding time) are different from one another

Methodology Applied

Scientific EffectPressure bonding: Heating

Data Source

PatentUS9477123B2Liquid crystal display device and production method thereof

Publication Date: 2016.10.25 MAGNOLIA WHITE CORP

AI summary

This disclosure aims to reduce workloads and material costs when a driving circuit and a flexible wiring board are fixed to a first substrate. A display device includes a display panel having the first substrate. The driving circuit is fixed to the first substrate in a portion other than a display portion with an anisotropic conductive film. The flexible wiring board is fixed to the first substrate at an end of the portion other than the display portion with an anisotropic conductive film. The anisotropic conductive film for fixing the driving circuit and the anisotropic film for fixing the flexible wiring board are the same. The anisotropic conductive film is also formed and hardened in a region other than a region having the driving circuit and the flexible wiring board fixed therein within the portion other than the display portion of the first substrate.