Single Camera Mounting Apparatus with Dual Optical Deflection
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Solution Overview
Problem
Existing apparatuses for mounting components on substrates require two cameras to determine the position of the component and substrate location, leading to inefficient movement paths and increased space requirements due to the need for the bonding head to travel to multiple cameras.
Innovation Solution
An apparatus utilizing a single camera and two optical deflection systems, where the first optical deflection system moves the camera's optical axis closer to the bonding head's gripping axis, and the second system allows for image recording of the component's bottom side during travel, enabling precise positioning without the need for additional cameras or complex movements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If two cameras are used to determine component position and substrate location, then positioning accuracy is improved, but device complexity and space requirements increase
Solution Approach 1:
A single camera is designed to perform multiple functions: capturing images of the component bottom side and substrate location by switching between different optical paths. The camera system achieves multi-functionality through optical deflection mechanisms that redirect light from different sources to the same sensor, eliminating the need for separate cameras while maintaining positioning accuracy for both component and substrate
Solution Approach 2:
Optical deflection systems act as intermediaries between the single camera and the two targets (component and substrate). The deflection systems redirect optical paths so that one camera can sequentially or alternatively capture images from both the component bottom side and substrate location, serving as a mediator that enables one device to perform the work of two
2Measurement precision
If two cameras are arranged at different locations, then positioning accuracy is improved, but the bonding head travel path increases
Solution Approach 1:
The single camera system provides multi-functional imaging capability, allowing the bonding head to capture both component and substrate position data from a single location. This eliminates the need for the bonding head to travel to separate camera positions, reducing travel path length while maintaining the ability to determine both positions accurately through optical path switching
3Device complexity
If a single camera is used, then device complexity and space requirements are reduced, but positioning capability is limited
Solution Approach 1:
Optical deflection systems serve as intermediaries that enable a single camera to access multiple imaging targets. By redirecting optical paths from the component bottom side and substrate to the single camera sensor, the deflection systems expand the camera's positioning capability without adding more cameras, thus maintaining versatility while reducing device complexity
Solution Approach 2:
The patent uses optical deflection to add a temporal or sequential dimension to the imaging process, allowing one camera to capture multiple positions at different times or through path switching. This dimensional approach enables a single camera to perform what would traditionally require multiple simultaneous cameras, maintaining full positioning capability while reducing component count
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the need for multiple cameras, minimizes space requirements, and allows for precise positioning of components with reduced optical path lengths, enhancing the working range and efficiency of the mounting process.
Implementation Method 1
a first optical deflection system (8) which deflects an optical axis (16) of the camera (7) closer to a gripping axis (15) of the bonding head (6)
Implementation Method 2
a second optical deflection system (9) which deflects a bottom side of the component (1) held by the bonding head (6) into the field of vision of the camera (7)
Data Source
AI summary
An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height H1 above the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H2, so that the substrate location is situated in the focal plane of the camera.