Single Carrier Sensor with Transfer Mold Housing
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Solution Overview
Problem
Existing sensor technologies are not cost-effective and compact, requiring multiple packaging steps and separate components for micromechanical sensor elements and signal processing, which increases complexity and space usage.
Innovation Solution
A sensor design featuring a single carrier means, such as a leadframe or printed circuit board, with unpackaged semiconductor components and a transfer mold housing, where the sensor elements and signal processing elements are encapsulated and connected using bonding or flip-chip technology, and an overmold housing for protection, allowing for a compact and efficient modular production method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate packaging steps are used for micromechanical sensor elements and signal processing components, then each component can be individually protected and tested, but the production process becomes complex and time-consuming
Solution Approach 1:
The patent combines multiple packaging operations into a single transfer molding process. The sensor element and signal processing component are mounted on a carrier, and both are encapsulated simultaneously in one transfer molding step, eliminating the need for separate packaging steps for each component type.
Solution Approach 2:
The transfer molding process serves multiple functions simultaneously: it provides mechanical support for the components, protects them from environmental influences, establishes electrical connections through the carrier, and encapsulates both sensor and signal processing elements in a single operation.
2Adaptability or versatility
If multiple separate components are used for sensor elements and signal processing, then functional flexibility is improved, but space usage and component count increase
Solution Approach 1:
The sensor element and signal processing component are integrated on a single carrier structure, reducing the overall package volume. The carrier acts as a common platform that brings both functional elements into close proximity, eliminating the need for separate housings and interconnection structures.
Solution Approach 2:
The signal processing component is positioned adjacent to and integrated with the sensor element on the same carrier. The transfer mold housing encapsulates both components together, creating a nested arrangement where multiple functional elements coexist within a single compact package volume.
3Ease of manufacture
If unpackaged semiconductor components are used, then manufacturing cost is reduced, but protection from environmental influences is compromised
Solution Approach 1:
The transfer molding process simultaneously provides mechanical support and environmental protection for the unpackaged semiconductor components. The molding compound encapsulates the bare die, protecting them from moisture, dust, and mechanical damage while maintaining the cost advantages of using unpackaged components.
Solution Approach 2:
The transfer mold housing acts as an intermediary structure that bridges the gap between cost-effective unpackaged components and the need for environmental protection. It provides a protective enclosure without requiring expensive pre-packaged components.
Data Source
AI summary
A sensor having at least one sensor element (1), at least one signal processing element (2), and a housing (7) which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means (4) on which the at least one sensor element (1) and the signal processing element (2) are arranged and are electrically connected to the carrier means. The carrier means (4) is also at least electrically connected to the electrical interface.