Single-Chamber Robot Controller Cabinet With Cross Air-to-Air Cooling
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Solution Overview
Problem
Existing robot controller cabinets are bulky and expensive due to the separation of electronic components into two different chambers for heat management, which affects the operational efficiency and compactness.
Innovation Solution
A compact robot controller cabinet design with a single chamber that integrates both high and moderate heat density electronic components, utilizing a cross air-air exchanger and cooling channel to manage heat dissipation effectively, ensuring optimal operation and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are separated into two different chambers for heat management, then the operational reliability is improved, but the device complexity and volume increase
Solution Approach 1:
The patent segments the cooling function into two independent circuits: a first cooling circuit for high heat density components and a second cooling circuit for moderate heat density components. This segmentation allows each circuit to be optimized for its specific thermal requirements while sharing the same physical chamber space, thereby maintaining reliability without increasing device complexity
Solution Approach 2:
The single chamber design serves multiple functions simultaneously: it houses both high and moderate heat density electronic components, contains both cooling circuits, and provides a unified structural enclosure. This multi-functionality eliminates the need for separate chambers while maintaining proper thermal management for different component types
2Reliability
If electronic components are separated into two different chambers for heat management, then the operational reliability is improved, but the volume and cost increase
Solution Approach 1:
The patent implements a nested arrangement where the first and second cooling circuits are positioned one above the other within the single chamber. The high heat density components and their cooling circuit are nested in the lower portion, while the moderate heat density components and their cooling circuit occupy the upper portion. This vertical nesting allows both cooling circuits to coexist in the same chamber volume without significant space increase
Solution Approach 2:
The patent transitions from a horizontal separation approach (two side-by-side chambers) to a vertical separation approach (two stacked cooling circuits within one chamber). By utilizing the vertical dimension for circuit differentiation while maintaining a unified horizontal chamber structure, the design achieves thermal management for different component types without increasing the overall cabinet footprint
3Volume of stationary object
If high heat density electronic components are placed in the same chamber as moderate heat density components, then the device compactness is improved, but the temperature control for moderate heat density components deteriorates
Solution Approach 1:
The cooling function is segmented into two independent circuits that can be independently controlled and optimized. The first cooling circuit is dedicated to high heat density components with high thermal power handling capacity, while the second cooling circuit serves moderate heat density components with appropriate cooling capacity. This segmentation prevents thermal interference between different component types while maintaining a compact single-chamber design
Solution Approach 2:
Each cooling circuit is designed with local quality optimized for its specific thermal requirements. The first cooling circuit features high thermal power handling capacity with appropriate heat exchangers and flow rates for high heat density components, while the second cooling circuit is designed with lower thermal power handling capacity suitable for moderate heat density components. This localized optimization ensures proper temperature control for each component type within the same chamber
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains proper functioning of all electronic components by effectively dissipating heat from high heat density components without significantly impacting moderate heat density components, while being compact and cost-effective.
Implementation Method 1
a cross air-air exchanger arranged in the cooling channel and comprising a first cooling circuit having an inlet opening passing through the lower panel of the chamber and an outlet opening passing through the lower panel of the chamber and a second cooling circuit having an inlet opening opposite the inlet opening of the cooling channel and an outlet opening parallel to the inlet opening of the second cooling circuit
Implementation Method 2
at least one fan capable of sucking in outside air through an inlet opening of the cooling channel and of discharging it to the outside through an outlet opening located at the end opposite the inlet opening of the cooling channel
Implementation Method 3
at least one air-component heat exchanger associated with a first electronic unit and receiving, on a first side at least one high heat density electronic component and carrying on a second side at least one cooling element arranged in the cooling channel
Data Source
Figure 1
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AI summary
The present invention relates to a robot controller cabinet comprising: - a chamber (8); - a first and a second electronic unit (20, 30) comprising respectively a high heat density electronic component (21) and a moderate heat density electronic component; - a cooling channel comprising a fan (16) and an inlet (12) provided on a front face (4A) of the cabinet; - an air-component heat exchanger carrying a cooling element.According to the invention, a cross air-to-air heat exchanger is arranged in the channel and comprises: - a first cooling circuit with an inlet and an outlet passing through a lower panel (8B) of the chamber; - a second cooling circuit with a parallel inlet and outlet, the inlet being opposite the inlet of the channel; - a fan (48), generating in the first cooling circuit an airflow perpendicular to an airflow generated in the second cooling circuit by the fan of the channel.