Single-Chamber Wafer Decomposition and Scanning Layout

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Solution Overview

Problem

Traditional vapor phase decomposition and scanning techniques for semiconductor wafers require separate chambers, leading to limited throughput, increased equipment usage, and exposure risks due to the handling of toxic chemicals, while also occupying significant physical space.

Innovation Solution

A system with a single chamber for both decomposition and scanning of semiconductor wafers, utilizing a nebulizer to aerosolize decomposition fluids directly onto the wafer and a nozzle system to guide scanning fluids along the wafer surface, with a motor system controlling the wafer position and a fluid handling system for controlled fluid introduction and removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate chambers are used for decomposition and scanning, then each process can be performed with dedicated equipment, but the equipment footprint increases and processing time is extended

Engineering Contradiction:

Improveprocess reliabilityVSAvoidprocessing throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent combines the decomposition chamber and scanning chamber into a single integrated chamber. The decomposition region and scanning region share the same vacuum chamber environment, allowing the wafer to be processed sequentially without chamber transitions. This merging eliminates the time required for chamber switching while maintaining the functional separation needed for reliable decomposition and scanning processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single chamber is designed to perform multiple functions: it serves as both the decomposition chamber and the scanning chamber. The chamber can accommodate different configurations of decomposition sources and scanning nozzles, allowing it to fulfill the roles of multiple dedicated chambers while reducing the overall equipment footprint and improving throughput.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If separate chambers are used for decomposition and scanning, then each process has dedicated control, but the system complexity and space requirements increase

Engineering Contradiction:

Improvesystem implementationVSAvoidchamber configuration

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the decomposition and scanning chambers into a single integrated chamber, reducing the number of separate vacuum systems, door mechanisms, and alignment systems required. This consolidation simplifies the overall system architecture while maintaining the functional independence needed for both processes through careful spatial arrangement and controlled access regions.

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If toxic chemicals are handled in separate chambers, then chemical exposure can be isolated, but the handling process increases exposure risk and processing time

Engineering Contradiction:

Improvechemical exposure riskVSAvoidwafer handling time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The patent combines decomposition and scanning in a single chamber, allowing the wafer to remain in the vacuum environment throughout both processes. This eliminates the need to break vacuum and handle the wafer in air between decomposition and scanning, thereby reducing exposure time to toxic chemicals while maintaining isolation of the chemical processes within the controlled chamber environment.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If multiple chambers are used, then each process can be optimized independently, but the equipment footprint and cost increase

Engineering Contradiction:

Improveprocess optimizationVSAvoidequipment footprint

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the decomposition and scanning chambers into a single integrated chamber, significantly reducing the equipment footprint. The chamber is designed with distinct regions for decomposition and scanning that can be independently optimized, maintaining process optimization capabilities while eliminating the space required for separate chambers and their associated infrastructure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This integrated approach reduces processing time, minimizes chemical exposure, and consolidates equipment footprint, enabling efficient and safer analysis of wafer impurities with improved throughput.

Implementation Method 1

utilizing a nebulizer to aerosolize decomposition fluids directly onto the wafer

Methodology Applied

Scientific EffectAerosolization: Aerosol

Implementation Method 2

a motor system operably coupled with the wafer support, the motor system configured to control a vertical position of the wafer support with respect to the chamber body

Methodology Applied

Scientific EffectMechanical positioning: Linear Motor

Data Source

PatentUS11804390B2Systems for integrated decomposition and scanning of a semiconducting wafer

Publication Date: 2023.10.31 ELEMENTAL SCI

AI summary

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.