Single-Chip Photo Coupler Structure for Low-Loss Optical Isolation
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Solution Overview
Problem
Conventional photo coupler devices have separate LED and light detection units, leading to significant light signal transmission loss, excessive device volume, and high manufacturing costs due to complex assembly processes.
Innovation Solution
A photo coupler single chip structure integrating a light-emitting unit and a light-receiving unit with an electrical insulation layer, allowing direct optical signal transmission through the insulation layer, reducing volume and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate LED and light detection units are used, then electrical insulation is achieved, but light signal transmission loss increases significantly
Solution Approach 1:
The patent merges the LED and light detection units onto a single chip substrate, eliminating the physical separation between these components. This integration allows the light signal to travel directly from the LED through the electrical insulation layer to the light detection unit without exiting the chip, thereby maintaining electrical insulation while dramatically reducing light signal transmission loss.
2Reliability
If two independent chips are mounted on lead frame, then electrical insulation is maintained, but device volume increases substantially
Solution Approach 1:
The patent combines both the light-emitting unit and light-detecting unit onto a single chip substrate, eliminating the need for separate chips and lead frame mounting. This integration substantially reduces the overall device volume while maintaining electrical insulation through the insulating layer positioned between the two functional units on the same chip.
Solution Approach 2:
The patent transitions from a three-dimensional arrangement with separate chips mounted on a lead frame to a planar integration on a single chip substrate. By arranging the LED and light detection unit on the same chip in close proximity with vertical or lateral positioning, the device achieves compact footprint while maintaining functional separation through the insulating layer.
3Adaptability or versatility
If separate chips are used, then manufacturing flexibility is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates both functional units on a single chip substrate, which can be fabricated using standard semiconductor manufacturing processes. This approach simplifies the manufacturing workflow by eliminating separate chip mounting, alignment, and bonding steps, thereby reducing manufacturing complexity and cost while maintaining design flexibility through the insulating layer configuration.
4Use of energy by moving object
If optical signal passes through air or encapsulating medium, then light transmission is possible, but external quantum efficiency decreases
Solution Approach 1:
The patent introduces an electrical insulation layer as an intermediary medium between the LED and light detection unit. This insulating layer, positioned within the chip structure, enables direct optical signal transmission from the LED to the photodetector while maintaining electrical isolation. The use of this intermediary layer eliminates the need for light to travel through air or external encapsulating media, thereby preserving external quantum efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances external quantum efficiency and reduces device volume while lowering manufacturing costs and time.
Implementation Method 1
The light-emitting unit can form an optical signal in response to an input signal
Implementation Method 2
The light-receiving unit will directly absorb the optical signal through the electrical insulating layer and convert it into an output signal
Data Source
AI summary
A photo coupler single chip structure and a manufacturing method thereof are provided. The photo coupler single chip structure includes a light-emitting unit, a light-receiving unit and an electrical insulation layer. The electrical insulation layer physically connects the light-emitting unit and the light-receiving unit to two opposite sides of the electrical insulation layer. The light-emitting unit can form an optical signal in response to an input signal. The light-receiving unit will directly absorb the optical signal through the electrical insulating layer and convert it into an output signal.