Single-Column Semiconductor Module Arrangement in Power Converters
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Solution Overview
Problem
Existing electric power converters with stacked-layer units and semiconductor modules have a mismatch between the length of the terminal strip and the frame, leading to dead space and increased manufacturing costs due to the need for elongated, narrow AC busbars with different shapes, which complicates cooling and assembly.
Innovation Solution
The electric power converter is redesigned with semiconductor modules arranged in a single column along the stacking direction, allowing for a longer stacked-layer unit and reduced width, enabling identical AC busbar shapes and reduced metal usage, and facilitating efficient assembly by handling busbars as a single component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor modules are arranged in two columns along the stacking direction, then the width of the stacked-layer unit is reduced, but the terminal strip becomes excessively long relative to the frame, creating dead space
Solution Approach 1:
The patent transitions from a two-column arrangement to a single-column arrangement of semiconductor modules, effectively changing the spatial dimension of the layout. This single-column configuration allows the stacked-layer unit to extend longer in the stacking direction while reducing width, and the terminal strip can be positioned to match the new dimensional proportions, eliminating dead space.
2Area of stationary object
If AC busbars are made elongated and narrow to fit the two-column configuration, then the width of the converter is minimized, but the electrical resistance increases and manufacturing becomes difficult
Solution Approach 1:
By changing from a two-column to a single-column arrangement, the patent alters the spatial relationships such that AC busbars connect to AC terminals that are closer together along the stacking direction. This enables the busbars to have a more compact, less elongated shape, reducing electrical resistance and simplifying manufacturing processes.
3Ease of operation
If multiple different shaped AC busbars are used to accommodate the two-column layout, then the converter fits the terminal strip configuration, but the number of different component parts increases, raising manufacturing costs
Solution Approach 1:
The single-column arrangement of semiconductor modules creates a symmetric and uniform configuration where all AC terminals are positioned similarly along the stacking direction. This homogeneity allows all AC busbars to be made with the same shape and dimensions, reducing the number of different component parts and simplifying manufacturing and inventory management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more compact converter with lower manufacturing costs, reduced electrical resistance, and improved manufacturing efficiency by eliminating dead space and simplifying the handling of busbars during assembly.
Implementation Method 1
a plurality of coolant flow passages formed in coolant tubes (110), with the semiconductor modules being cooled by a flow of a coolant through the coolant flow passages
Data Source
AI summary
In an electric power converter, a stacked-layer unit has a plurality of semiconductor modules arrayed as layers along a stacking direction, each semiconductor module containing a semiconductor element and a pair of power terminals protruding outward in a protrusion direction at right angles to the stacking direction, each pair consisting of an AC terminal and a positive-polarity or negative-polarity power terminal. The semiconductor modules are arranged with the positive-polarity and negative-polarity power terminals in a single column at one side of the stacked-layer unit, and respectively connected to a positive-polarity busbar and negative-polarity busbar which are located at that side and which are separated by a fixed spacing in the protrusion direction, while the AC terminals of each layer-adjacent pair of semiconductor modules are connected in common to a corresponding one of a plurality of AC busbars.