Single-Crystal Chamber Coating for Plasma Corrosion Resistance
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Solution Overview
Problem
Existing chamber coatings are susceptible to corrosion in plasma or strong corrosive atmospheres, leading to contamination of devices during semiconductor manufacturing.
Innovation Solution
A method involving a substrate coated with alternating layers of SiOx, AlOy, and YOz, followed by heating to form a single crystalline layer through solid-state reaction, providing a coating material with enhanced corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating material is applied to the chamber inner surface to protect against corrosion, then corrosion resistance is improved, but the coating material itself gets corroded by plasma or strong acid etching atmosphere, leading to contamination
Solution Approach 1:
The invention uses a composite coating structure consisting of multiple layers with different compositions (SiO2 layer, Al2O3 layer, and Y2O3 layer) stacked in sequence. Each layer provides specific protective functions: SiO2 for basic corrosion resistance, Al2O3 for enhanced chemical stability, and Y2O3 for plasma resistance. The composite structure synergistically resists both plasma and strong acid corrosion better than single-material coatings.
Solution Approach 2:
The coating structure applies different material compositions to different layers based on their specific protective functions. The SiO2 layer (5-20 nm) provides initial protection, the Al2O3 layer (20-50 nm) offers intermediate chemical stability, and the Y2O3 layer (50-200 nm) provides the primary plasma resistance barrier. This localized differentiation of material properties optimizes overall corrosion resistance.
2Ease of manufacture
If existing coating materials are used, then the chamber can be manufactured, but the coating deteriorates under corrosive conditions causing aggregates to fall and contaminate devices
Solution Approach 1:
The multi-layer coating structure is applied in advance to the chamber inner surface before device manufacturing. This preliminary protective barrier prevents corrosion-induced aggregate formation during subsequent plasma processing and etching operations, ensuring device cleanliness without interfering with manufacturing processes.
Solution Approach 2:
The Y2O3 layer acts as an intermediary barrier between the corrosive plasma environment and the chamber substrate. It absorbs the primary corrosive attack from plasma, protecting the underlying SiO2 and Al2O3 layers and preventing degradation that would lead to contamination.
3Productivity
If strong acid etchants are used to quickly etch and remove specific parts, then productivity is improved, but the chamber window and inner wall are corroded
Solution Approach 1:
The coating structure changes the chemical resistance parameters of the chamber surface. The Al2O3 and Y2O3 layers provide enhanced chemical stability against strong acid etchants, allowing aggressive etching processes to proceed at high speeds without compromising chamber integrity or causing corrosion-related contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting coating material, such as Y2SiO5 or YAG, effectively prevents contamination by maintaining integrity in plasma or corrosive environments, ensuring high-quality device production.
Implementation Method 1
heating the laminate to provide a coating layer of a single crystalline layer by a solid-state reaction between the first coating portion and the second coating portion
Implementation Method 2
provide a coating layer of a single crystalline layer by a solid-state reaction
Data Source
AI summary
A method for manufacturing a coating material formed on an inner surface of a chamber is provided. The method includes: i) providing a substrate including at least one material selected from the group consisting of SiC, SiO2, and Al2O3; ii) providing a first coating portion including SiOx (0.1≤x≤2 as a molar ratio) or AlOy (0.1≤y≤1.5 as a molar ratio) on the substrate; iii) providing a second coating portion including YOz (0.1≤z≤1.5 as a molar ratio) on the first coating portion; iv) providing a laminate in which the first coating portion and the second coating portion are repeatedly stacked; and v) heating the laminate to provide a coating layer of a single crystalline layer by a solid-state reaction between the first coating portion and the second coating portion.