Single-Crystal Silicon Strain Sensor for Battery Swelling Detection
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Solution Overview
Problem
Secondary batteries face challenges in measuring deformation and swelling, which can lead to increased risk of explosion, and existing strain sensors lack sensitivity and accuracy in detecting these phenomena.
Innovation Solution
A strain sensor using a thin-film single-crystal silicon-based strain gauge is developed, attached to the exterior of a secondary battery case, with a backing part, wiring, and encapsulation to detect deformation and swelling accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a strain sensor is attached to measure deformation and swelling of secondary batteries, then the ability to detect safety risks is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The strain sensor is divided into distinct functional layers: a flexible substrate for mounting, a single-crystal silicon strain gauge layer for sensing, and an encapsulation layer for protection. This segmentation allows each layer to be optimized independently while simplifying the overall manufacturing process through modular assembly.
Solution Approach 2:
The sensor employs a composite structure combining the flexibility of polymer substrates with the high sensitivity of single-crystal silicon strain gauges, and protects them with an encapsulation layer. This composite approach achieves both safety monitoring capability and manufacturing feasibility.
2Measurement precision
If existing strain sensors are used to detect battery deformation, then the manufacturing process is simpler, but the measurement precision and sensitivity are insufficient
Solution Approach 1:
The patent replaces conventional mechanical strain gauge structures with a thin-film single-crystal silicon-based strain gauge fabricated using semiconductor processing techniques. This substitution achieves superior measurement precision through atomic-level crystal structure control while enabling batch manufacturing through standardized photolithography and etching processes.
Solution Approach 2:
The strain gauge sensitivity is optimized by controlling the thickness of the single-crystal silicon layer (100-300 nm) and adjusting the etching depth to expose the crystalline structure. These parameter changes maximize the piezoresistive effect for high-precision deformation detection.
3Measurement precision
If a thin-film single-crystal silicon strain gauge is used to improve sensitivity, then the measurement accuracy is improved, but the manufacturing process complexity increases
Solution Approach 1:
The single-crystal silicon strain gauge layer is pre-fabricated on a silicon wafer with controlled crystal orientation before being transferred to the flexible substrate. This preliminary fabrication allows precise control of gauge factors through crystal orientation selection, while the transfer process simplifies final assembly.
Solution Approach 2:
A flexible substrate serves as an intermediary carrier that receives the pre-fabricated single-crystal silicon strain gauge layer through transfer printing. This intermediary approach decouples the complex thin-film fabrication from the final sensor assembly, reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The strain sensor effectively measures deformation and swelling of secondary batteries with high sensitivity and accuracy, reducing the risk of explosion and improving battery safety.
Implementation Method 1
a strain gauge installed on the backing part and formed of single-crystal silicon
Implementation Method 2
a backing part attached to an exterior of a case of a secondary battery
Data Source
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AI summary
Disclosed is a secondary battery including a case configured to surround an exterior of an electrode assembly, and a strain sensor attached to an exterior of the case to detect deformation of the case. The strain sensor may include a backing part attached to the exterior of the case; a strain gauge installed on the backing part and formed of single-crystal silicon; a wiring part stacked on the backing part, along with the strain gauge, and electrically connected to the strain gauge; and an encapsulation part fixed to the backing part while surrounding the strain gauge and the wiring part excluding a portion of the wiring part.