Single-Crystal YAG Plasma Components for Low-Particle Etching
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Solution Overview
Problem
Existing plasma treatment device components, such as gas nozzles and windows, suffer from particle generation due to insufficient plasma resistance, leading to defects in semiconductor manufacturing processes.
Innovation Solution
Utilizing a plasma resistant member with surfaces exposed to plasma formed from single crystal yttrium-aluminum-garnet (YAG) with a {100} plane, which offers superior plasma resistance and reduces particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic sintered bodies such as alumina are used for plasma treatment device components, then the components can be manufactured with existing materials and processes, but particle generation occurs due to insufficient plasma resistance
Solution Approach 1:
The invention changes the material parameter from polycrystalline ceramic to single crystal structure, and specifically selects the crystal orientation with {100} plane as the surface exposed to plasma. This parameter change in crystal structure and orientation significantly improves plasma resistance and reduces particle generation compared to conventional alumina ceramics.
Solution Approach 2:
The invention uses composite construction by combining single crystal YAG material with specific crystal orientation ({100} plane) for the plasma-exposed surfaces. This creates a material system that leverages both the inherent properties of single crystal structure and the advantageous orientation to achieve superior plasma resistance.
2Reliability
If yttrium or YAG materials are used instead of alumina, then plasma resistance is improved, but further reduction of particle generation is required for high-quality manufacturing
Solution Approach 1:
The invention applies local quality by specifically orienting the {100} crystal plane to the surface that is exposed to plasma. This localized optimization of crystal orientation at the plasma-facing surface maximizes plasma resistance and minimizes particle generation where it matters most, while allowing other parts of the component to maintain structural integrity.
Solution Approach 2:
The invention changes the critical parameter of crystal orientation to {100} plane for the plasma-exposed surface. This specific parameter change in crystallographic orientation provides superior plasma resistance and reduces particle generation, achieving the highest level of plasma resistance among YAG crystal orientations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of single crystal YAG with a {100} plane enhances corrosion resistance and minimizes particle formation, ensuring high-quality plasma treatment processes.
Implementation Method 1
a surface exposed to plasma is formed from a single crystal yttrium⋅aluminum⋅garnet (YAG) having a {100} plane
Data Source
AI summary
The present disclosure relates to a plasma resistant member in which a surface exposed to plasma is formed from a single crystal yttrium⋅aluminum⋅garnet (YAG) having a {100} plane, and a plasma treatment device component and a plasma treatment device using the plasma resistant member. When there are a plurality of surfaces exposed to plasma, at least a surface required to have the highest plasma resistance is formed from the single crystal YAG having a {100} plane.