Single-Die Passive Ionizing Radiation Sensor with Integrated Detection Circuitry

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing radiation sensors are labor-intensive, unsuitable for mass production, and often require separate detection circuitry, making them costly and inefficient for detecting ionizing radiation exposure in various applications.

Innovation Solution

A radiation sensor is fabricated on a single die with a radiation hardened area and a radiation sensitive area, where the property change upon exposure to ionizing radiation is detected by circuitry within the hardened area, allowing for remote transmission of the detected change without the need for external power.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If thermoluminescent devices or chromatic tags are used as radiation sensors, then radiation detection capability is achieved, but labor-intensive manual analysis and evaluation are required

Engineering Contradiction:
Improveradiation detection capabilityVSAvoidmanual analysis efficiency
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent combines the radiation sensitive area and the detection circuitry onto a single die, creating an integrated radiation sensor. This merging eliminates the need for separate manual analysis equipment and processes, enabling automated detection and significantly improving productivity while maintaining measurement precision.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The radiation sensor is designed to automatically detect and process radiation exposure without requiring manual intervention. The detection circuitry on the die automatically measures property changes in the radiation sensitive area and generates output signals, making the system self-sufficient and eliminating labor-intensive manual analysis.

Inventive Principle:
Principle #25Self-service

2Productivity

If circuits are used as radiation sensors with remote detection circuitry, then mass production suitability is improved, but the sensor becomes single-use and disposable

Engineering Contradiction:
Improvemass production suitabilityVSAvoidsensor reusability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

By integrating both the radiation sensitive area and detection circuitry on a single die, the patent creates a compact sensor that maintains the mass production suitability of circuit-based sensors while reducing the complexity that led to disposable design. The integrated structure allows for potential reuse or regeneration of the entire sensor unit.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If radiation sensor and detection circuitry are placed in separate locations, then radiation impact on detection circuitry is avoided, but device complexity and cost increase

Engineering Contradiction:
Improvedetection circuitry protectionVSAvoidsystem structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating distinct regions on the die: a radiation sensitive area that intentionally responds to radiation and a radiation hardened area with detection circuitry that is protected from radiation damage. This spatial differentiation on the same substrate provides both radiation detection capability and circuit protection while maintaining system simplicity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The integration of radiation sensitive and detection circuitry on a single die eliminates the need for separate physical locations, reducing device complexity while maintaining the functional separation needed for radiation protection. The compact integrated design lowers cost and simplifies the overall system architecture.

Inventive Principle:
Principle #5Merging (Combining)

4Adaptability or versatility

If multiple separate components are used for radiation sensing, then functional capabilities are achieved, but manufacturing cost and complexity increase

Engineering Contradiction:
Improvefunctional capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges multiple functional components (radiation sensitive area, detection circuitry, and output generation) into a single integrated die. This consolidation maintains all necessary functional capabilities while significantly simplifying manufacturing processes and reducing overall component count, thereby lowering manufacturing cost and complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated die serves multiple functions simultaneously: it detects radiation exposure, measures property changes, generates output signals, and can transmit data. This multi-functionality within a single component reduces the need for separate parts and simplifies the overall system, improving ease of manufacture while maintaining versatility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a compact, inexpensive, and non-invasive radiation sensor that can be used in mass production environments, offering real-time monitoring of ionizing radiation exposure without labor-intensive processes, enabling efficient detection and data transmission.

Implementation Method 1

A property of the radiation sensitive area changes when exposed to ionizing radiation

Methodology Applied
Scientific EffectIonizing radiation effect: Ionisation

Data Source

PatentUS7718963B2Passive solid state ionizing radiation sensor
Publication Date: 2010.05.18 HONEYWELL INTERNATIONAL INC
  • US7718963B2 patent drawing
  • US7718963B2 patent drawing
  • US7718963B2 patent drawing

AI summary

A radiation sensor and a method for making the radiation sensor are described. An ionizing radiation sensitive area is formed in a radiation insensitive or hardened die. When the sensitive area is impacted by ionizing radiation, properties of the sensitive area change. For example, the changed property may be charge density, threshold voltage, leakage current, and/or resistance. Circuitry for measuring these property changes is located in a radiation hardened area of the die. As a result, a radiation sensor may be fabricated on a single die.