Single Fan Airflow Division for Multi-Processor Cooling
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Solution Overview
Problem
Electronic devices such as multimedia devices and set-top boxes face challenges in providing both effective and silent cooling, as existing cooling systems often generate significant background noise due to multiple fans, which disrupt user experience.
Innovation Solution
The design involves a single fan that channels airflow through a casing to efficiently cool multiple processors with radiators positioned to receive air at similar temperatures, eliminating the need for multiple fans and minimizing noise by optimizing airflow pathways and heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple fans are used to cool multiple processors, then cooling effectiveness is improved, but background noise increases
Solution Approach 1:
The patent merges multiple cooling functions into a single fan system. One fan generates an airflow that is divided by the casing into multiple streams, each cooling a different processor. This consolidation reduces the number of fans from multiple to one, thereby reducing background noise while maintaining effective cooling of multiple processors through strategic airflow division.
Solution Approach 2:
The patent segments the airflow generated by a single fan into multiple independent streams using the casing structure. The casing divides the airflow into first, second, and third streams that separately cool different processors. This segmentation allows one fan to perform the cooling function of multiple fans, reducing noise while maintaining cooling effectiveness.
2Object-generated harmful factors
If a single fan is used to cool multiple processors, then background noise is reduced, but cooling effectiveness may be compromised
Solution Approach 1:
The patent adds spatial dimensionality to the cooling system by using a casing that divides airflow into multiple spatial streams. Instead of one airflow path, the casing creates separate three-dimensional flow paths that can simultaneously cool multiple processors located at different positions, ensuring each processor receives adequate cooling air from the single fan.
Solution Approach 2:
The patent applies local quality by directing specific portions of the airflow to specific processors based on their individual cooling requirements and positions. The casing structure creates localized airflow streams tailored to cool each processor effectively, with each stream having appropriate velocity and temperature characteristics for its target processor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures efficient cooling of multiple processors with reduced noise levels, as each processor receives air at similar temperatures, enhancing cooling efficiency without the need for multiple fans, thus improving user comfort by minimizing background noise.
Implementation Method 1
such a device generally incorporates one or more fans to cool its components by establishing a forced air circulation inside its enclosure
Implementation Method 2
several integrated circuits such as processors equipped with radiators which are mounted in the apparatus so that their radiators are located facing different portions of the cross-section of the ducted airflow
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention relates to an electronic apparatus, such as a modem or the like, comprising a fan (18) and an inner casing (4) for directing the airflow generated by said fan (18), and a plurality of processors (6, 8) provided with heat sinks (7, 9) and mounted in the apparatus (1) such that the heat sinks (7, 9) are located opposite different portions (PS, PI) of the cross-section of the directed airflow and such that the various heat sinks (7, 9) are cooled by different portions (PS, PI) of the airflow. The invention can be used in the field of home electronics.