Single Fan Heat Dissipation System for Notebook Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional dual-fan cooling systems in high-performance notebook computers are noisy, vibrational, and consume high power, necessitating an improved heat dissipation solution.
Innovation Solution
A heat dissipation system utilizing a single fan, thermally coupled with heat pipes and heat dissipation arrays, where the fan generates airflows towards heat sources and heat dissipation arrays, optimizing airflow usage and replacing sidewall design with support posts to form a structural support within the casing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a dual-fan cooling system is used to meet heat dissipation requirements, then heat dissipation performance is improved, but noise, vibration, and power consumption increase
Solution Approach 1:
The patent merges the functions of two separate fans into a single fan system. The first fan blows air to the first heat source, the second heat source and the first heat dissipation array, while the second fan blows air to the second heat dissipation array. This consolidation reduces the number of rotating components from two to one, thereby reducing noise and vibration while maintaining effective heat dissipation across all heat sources and arrays.
2Temperature
If a dual-fan cooling system is used to meet heat dissipation requirements, then heat dissipation performance is improved, but power consumption increases
Solution Approach 1:
The patent combines multiple fan functions into a single fan system that serves multiple heat sources and heat dissipation arrays. By using one fan instead of two, the system reduces power consumption while still providing adequate cooling to all components through strategically positioned fans that blow air to multiple targets simultaneously.
3Temperature
If multiple fans are used for heat dissipation, then cooling coverage is improved, but device complexity increases
Solution Approach 1:
The patent reduces system complexity by merging multiple fan functions into a single fan. The first fan is positioned to blow air to the first heat source, second heat source and first heat dissipation array, while the second fan blows air to the second heat dissipation array. This simplification reduces the number of components, assembly steps, and potential failure points while maintaining comprehensive cooling coverage through optimized airflow paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat with reduced noise, vibration, and power consumption by utilizing a single fan to direct airflows efficiently towards multiple heat sources and arrays, while providing structural support within the electronic device.
Implementation Method 1
The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source.
Implementation Method 2
heat pipes
Implementation Method 3
The single fan is located between the first heat source and the second heat source, and configured to blow airflows towards all of the first heat source, the second heat source, the first heat dissipation array and the second heat dissipation array.
Data Source
AI summary
A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.