Single Fin Doping Profile for Stress Reduction
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Solution Overview
Problem
The formation of single semiconductor fins in FinFETs for advanced technology nodes is challenging due to lack of support, leading to stress-related structural failures and increased current leakage caused by n-well implants in pFET devices.
Innovation Solution
An integrated circuit structure with a single active region having a first doping profile and a set of active regions with a second doping profile, where the second profile is deeper and has a higher dopant concentration, electrically isolated from the single active region to reduce the extent and number of n-well implants, thereby minimizing defects and stress-related failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If n-well implants are performed in single semiconductor fin for pFET devices, then device formation is enabled, but stress-related structural failures and current leakage occur
Solution Approach 1:
The patent segments the fins into two distinct groups: a first set of fins with a first doping profile and a second set of fins with a second doping profile. This segmentation allows the single fin to be electrically isolated from neighboring fins through different doping characteristics, preventing stress propagation while enabling controlled n-well implantation where needed.
Solution Approach 2:
The patent applies different doping profiles to different sets of fins based on their specific device requirements. The single fin receives a tailored doping profile that differs from the multi-fin arrangements, allowing localized optimization of stress management and electrical isolation for low-power devices while maintaining standard processing for other regions.
2Use of energy by moving object
If single semiconductor fin is used for low power devices, then power consumption is reduced, but support structure is lacking leading to manufacturing challenges
Solution Approach 1:
The patent changes the doping parameters (concentration, depth, profile shape) specifically for the single fin used in low-power devices compared to standard multi-fin configurations. This parameter adjustment provides the single fin with adequate electrical isolation and stress management without requiring additional physical support structures, thereby simplifying the manufacturing process while maintaining low power characteristics.
3Reliability
If n-well implants are reduced in single active region, then defects and stress failures are minimized, but device functionality must be maintained
Solution Approach 1:
The patent applies different doping profiles to different sets of fins based on their specific device requirements. The single fin receives a tailored doping profile that differs from the multi-fin arrangements, allowing localized optimization of stress management and electrical isolation for low-power devices while maintaining standard processing for other regions.
Solution Approach 2:
The patent changes the doping parameters (concentration, depth, profile shape) specifically for the single fin used in low-power devices compared to standard multi-fin configurations. This parameter adjustment provides the single fin with adequate electrical isolation and stress management without requiring additional physical support structures, thereby simplifying the manufacturing process while maintaining low power characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of reliable single semiconductor finFETs for low power devices at advanced technology nodes, reducing defects and performance degradation such as current leakage in p-finFETs by minimizing the impact of n-well implants.
Implementation Method 1
first doping the set of active regions and the single active region, creating a first doping profile in the set of active regions and the single active region; masking the single active region, leaving the set of active regions exposed; and second doping the set of active regions, creating a second doping profile in the set of active regions that is different than the first doping profile of the single active region
Data Source
AI summary
An integrated circuit (IC) structure with a single active region having a doping profile different than that of a set of active regions, is disclosed. The IC structure provides a single active region, e.g., a fin, on a substrate with a first doping profile, and a set of active regions, e.g., fins, electrically isolated from the single active region on the substrate. The set of active regions have a second doping profile that is different than the first doping profile of the single active region. For example, the second doping profile can have a deeper penetration into the substrate than the first doping profile.


