Single-Gage Leadframe for LED Package Thermal Dissipation
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Solution Overview
Problem
Current PLCC LED packages with dual-gage leadframes are expensive and inflexible, while those with single-gage leadframes lack efficient heat dissipation and reliability due to suboptimal interconnections with the plastic housing.
Innovation Solution
A light source package design utilizing a single-gage leadframe with a bonding pad and exposed bottom surface for direct heat dissipation to a PCB, combining the thermal benefits of dual-gage leadframes with the cost-effectiveness and flexibility of single-gage leadframes, and incorporating a manufacturing method that allows for stamping and punching to minimize costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a dual-gage leadframe is used for heat dissipation, then thermal dissipation efficiency is improved, but manufacturing cost increases and flexibility decreases
Solution Approach 1:
The patent combines the heat dissipation function and electrical connection function into a single single-gage leadframe structure. The leadframe simultaneously serves as the electrical conductor and thermal management component, eliminating the need for separate dual-gage construction while achieving comparable thermal performance through optimized geometry and PCB integration.
Solution Approach 2:
The single-gage leadframe is designed to perform multiple functions: electrical current conduction, mechanical support, and thermal dissipation. By integrating these functions into one component, the patent reduces manufacturing complexity and cost while maintaining the thermal management capabilities previously requiring dual-gage construction.
2Temperature
If a dual-gage leadframe is used for heat dissipation, then thermal dissipation efficiency is improved, but flexibility decreases
Solution Approach 1:
The patent merges the heat dissipation and electrical connection functions into a single flexible single-gage leadframe. This integrated structure maintains the thermal management performance of dual-gage designs while restoring flexibility, allowing the leadframe to be bent and adapted to various package configurations without the rigidity constraints of dual-gage construction.
3Ease of manufacture
If a single-gage leadframe with simple flat design is used, then manufacturing cost decreases, but interconnection reliability with plastic housing deteriorates
Solution Approach 1:
The patent applies local quality by creating non-flat, three-dimensional features at specific locations on the single-gage leadframe where housing interconnections occur. These localized structural variations provide mechanical anchoring points and improved bonding surfaces within the plastic housing, enhancing interconnection reliability without compromising the overall manufacturing simplicity or adding dual-gage complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient thermal dissipation, increased operational lifetime, and reduced package size while maintaining flexibility and lower costs compared to ceramic alternatives, enhancing the reliability of high-power LED packages.
Implementation Method 1
the bottom surface being exposed through a bottom face of the housing... efficient thermal dissipation... direct heat dissipation to a PCB
Data Source
AI summary
A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.