Single-Head Solder Ball Spray Head for Ordered Ball Implantation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing solder ball planting technologies are limited by the need for precise component alignment, deformation of steel meshes, high processing costs for small solder balls, and incompatibility with uneven surfaces, leading to inefficiencies and increased costs.
Innovation Solution
A single-head solder ball implantation spray head with a controlled mechanism using electromagnetic valves and channels to manage solder ball movement, enabling precise, efficient, and cost-effective implantation on various component shapes and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If steel mesh is used for ball planting, then ball implantation can be achieved, but the steel mesh deforms and damages under scraper pressure requiring frequent replacement
Solution Approach 1:
The patent extracts the ball implantation function from the steel mesh structure and transfers it to a suction head with adsorption holes. The steel mesh is completely removed from the system, eliminating its deformation and damage issues while maintaining the ball planting capability through vacuum adsorption and gas blowing mechanisms.
Solution Approach 2:
The patent replaces the mechanical scraper-steel mesh system with a pneumatic system using vacuum adsorption and gas blowing. Instead of mechanically scraping balls through a deformable mesh, the system uses controlled pressure differentials to transport and release solder balls, eliminating mechanical wear and deformation problems.
2Area of stationary object
If steel mesh area is increased for large-area ball planting, then coverage is improved, but the mesh deforms more easily reducing flatness
Solution Approach 1:
The patent segments the ball implantation process into discrete adsorption holes distributed across the suction head surface. Each hole independently adsorbs and releases balls, allowing the system to cover large areas without requiring a continuous rigid mesh structure, thus maintaining local flatness while achieving broad coverage.
Solution Approach 2:
The patent changes the fundamental parameter of ball transport from mechanical contact through a mesh to non-contact vacuum adsorption. This parameter change eliminates the flatness-deformation relationship entirely, as the suction head surface does not need to maintain rigid flatness when using distributed vacuum holes for ball manipulation.
3Length of moving object
If solder ball diameter is reduced for miniaturization, then component size is reduced, but solder balls accumulate on the steel mesh reducing yield
Solution Approach 1:
The patent uses pneumatic principles through vacuum adsorption and gas blowing to manipulate solder balls. The controlled pressure differentials allow precise ball transport and release without mechanical contact, preventing accumulation even for very small balls with high surface area-to-volume ratios that would readily adhere to mesh surfaces.
Solution Approach 2:
The patent introduces gas as an intermediary medium between the ball transport mechanism and the solder balls. Instead of direct mechanical contact with mesh structures, gas pressure differentials mediate the adsorption and release processes, eliminating the adhesion problems that cause small balls to accumulate on mesh surfaces.
4Quantity of substance
If suction cup adsorption holes are increased for large-area ball planting, then ball capacity is improved, but processing cost of the suction cup increases
Solution Approach 1:
The patent designs the suction head with a standardized structure containing multiple adsorption holes that can handle various ball sizes and quantities. The universal design allows the same suction head structure to serve multiple functions and applications, reducing per-unit costs through standardization while maintaining the capability to process large numbers of balls simultaneously.
5Adaptability or versatility
If component surface is uneven (curved or pre-attached), then steel mesh and screen printing are incompatible, but ball implantation is still required
Solution Approach 1:
The patent employs a movable suction head that can dynamically adjust its position and orientation relative to the component surface. The system uses real-time detection to adapt to uneven surfaces, maintaining optimal adsorption conditions despite surface variations, thus preserving implantation accuracy while achieving versatility across different surface types.
Solution Approach 2:
The patent incorporates detection mechanisms that provide feedback about component surface conditions to the control system. This feedback enables real-time adjustment of the suction head position, adsorption pressure, and gas blowing parameters, maintaining accurate ball implantation even on curved or pre-attached surfaces where fixed mesh or screen printing methods fail.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spray head ensures accurate and rapid implantation of solder balls over 0.06 mm in diameter, reducing accumulation and missing balls, and is suitable for components with uneven surfaces, enhancing precision and efficiency while maintaining low processing costs.
Implementation Method 1
a blanking control mechanism, which comprises a blanking control gas path 61, a ventilation channel 71 and a vacuum channel 72, wherein the blanking control gas path 61, the ventilation channel 71 and the vacuum channel 72 are respectively connected to a first electromagnetic valve 81
Implementation Method 2
the blanking control gas path 61, the ventilation channel 71 and the vacuum channel 72 are respectively connected to a first electromagnetic valve 81
Implementation Method 3
the blanking control gas path 61 is communicated with the position where the first feeding channel 3 communicates with the longitudinal blanking channel 2
Data Source
AI summary
The invention discloses a single-headed tin ball implantation spray head, which comprises a spray head body, wherein a longitudinal blanking channel and a feeding channel communicated with the longitudinal blanking channel are respectively formed in the spray head body, and a feeding channel communicated with the feeding channel is formed on the spray head body; A blanking control mechanism is arranged on the main body of the spray head, and the blanking control mechanism corresponds to the position where the feed channel is communicated with the longitudinal blanking channel. The single-head solder ball implantation spray head can control the solder balls to move quickly in the spray head body and spray out from the nozzle one by one in an orderly manner, can accurately implant the solder balls on the surface of a circuit board, a wafer or a chip, can accurately control the solder balls with a particle size of more than 0.06 mm for ball implantation, and has high ball implantation efficiency, yield and accuracy, and is suitable for ball implantation of components with various shapes, models and sizes, with low processing cost and good operation stability.