Single-Image Alignment Mark Identification on Dense Die Substrates
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Solution Overview
Problem
Existing lithography and metrology tools require multiple images to identify and locate alignment marks on densely packed substrates, leading to reduced productivity and increased production time and cost due to the increased number of alignment marks.
Innovation Solution
A system and method to identify and locate multiple alignment marks within a single image, using a digital lithography system with a spatial light modulator to project exposure patterns and an alignment mark identification system to determine the positions and identities of alignment marks on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple images are used to identify and locate alignment marks on densely packed substrates, then measurement precision is improved, but productivity deteriorates due to increased processing time
Solution Approach 1:
The patent merges multiple imaging operations into a single image capture. The optical system is configured to simultaneously capture multiple alignment marks on densely packed substrates in one image, eliminating the need for sequential imaging operations and thereby resolving the contradiction between measurement precision and productivity
Solution Approach 2:
The patent transitions from a sequential processing approach (multiple images over time) to a parallel processing approach (single image capturing multiple marks simultaneously). This dimensional change from temporal sequence to spatial parallelism enables both precise measurement and high productivity
2Manufacturing precision
If the number of alignment marks increases on substrates, then manufacturing precision is improved for better alignment, but processing time increases leading to reduced productivity
Solution Approach 1:
The system merges the detection and location of multiple alignment marks into a single processing operation. By capturing all alignment marks in one image and processing them simultaneously, the patent achieves high alignment accuracy without the time penalty of processing marks sequentially
Solution Approach 2:
The patent creates a digital copy (image) of all alignment marks simultaneously and processes this copy to determine positions and identities. This copying approach allows parallel analysis of multiple marks without physical manipulation time, maintaining both precision and speed
Data Source
AI summary
A system includes a memory and at least one processing device, operatively coupled to the memory, to detect, in an image of a plurality of dies on a substrate, a plurality of alignment marks, wherein each die of the plurality of dies includes at least one alignment mark of the plurality of alignment marks, select an alignment mark from the plurality of alignment marks, determine an identity of the alignment mark, and determine a location of the alignment mark.