Single Impedance Matching Network for Transceiver Circuits
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Solution Overview
Problem
Conventional wireless transceiver circuits require separate impedance matching networks for transmit and receive paths, leading to increased cost, size, and performance degradation due to coupling between these networks, as well as the need for off-chip components that are not energy-efficient.
Innovation Solution
A transceiver circuit with a single, programmably configured impedance matching network shared by both transmit and receive paths, implemented on an integrated circuit chip, which adjusts impedance transformation based on mode (RX or TX) to eliminate the need for a transmit/receive switch and reduce component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate impedance matching networks are used for transmit and receive paths, then impedance matching performance is improved, but device complexity and area consumption increase
Solution Approach 1:
The patent implements a single impedance matching network that serves both transmit and receive paths by using a time-division duplexing mechanism. The network is configured in different states during different time periods: first configuration for receive mode, second configuration for transmit mode. This eliminates the need for separate matching networks while maintaining performance through programmable reconfiguration.
Solution Approach 2:
The patent merges the functionality of separate transmit and receive impedance matching networks into a single unified network. By combining these functions and using temporal separation with programmable control, the design reduces component count and area consumption while achieving the same impedance matching objectives for both paths.
2Reliability
If off-chip components are used for impedance matching, then matching quality is improved, but cost and area consumption increase
Solution Approach 1:
The patent integrates the impedance matching network directly onto the chip, merging previously separate off-chip components with the transceiver circuitry. This integration reduces area consumption by eliminating discrete off-chip components and interconnections while maintaining matching quality through precise on-chip implementation and programmable control.
Solution Approach 2:
The patent replaces physical off-chip component connections with integrated on-chip circuitry and electronic control mechanisms. The mechanical/physical separation of components is substituted with electronic integration and software-controlled reconfiguration, achieving the same functional results with reduced physical footprint.
3Reliability
If a transmit/receive switch is used to isolate paths, then signal isolation is improved, but device complexity and power consumption increase
Solution Approach 1:
The patent employs time-division duplexing where the single impedance matching network is periodically reconfigured between receive and transmit modes. By alternating the operational state of the network in time, the design achieves signal isolation without requiring a continuous physical switch, thereby reducing power consumption associated with switch operation while maintaining path isolation.
Solution Approach 2:
The patent extracts and eliminates the transmit/receive switch from the signal path by using temporal separation instead. The switching function is removed entirely and replaced with time-division multiplexing of the single impedance matching network, reducing device complexity and power consumption while maintaining the necessary signal isolation between transmit and receive paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the area consumption and improves amplifier performance by eliminating the transmit/receive switch and allowing for cost-effective, on-chip impedance matching, enhancing power efficiency and noise figure while maintaining desired impedance transformations.
Implementation Method 1
The single impedance matching network is coupled to the antenna, directly connected to the shared node, and configured to transform an impedance of the antenna into a resistance at the shared node
Data Source
AI summary
Embodiments of transceiver circuits disclosed herein include a first amplifier coupled to receive signals from an antenna during a receive (RX) mode of the transceiver circuit, a second amplifier coupled to transmit signals to the antenna during a transmit (TX) mode of the transceiver circuit, and a single impedance matching network coupled to the antenna and directly connected to a shared node to which the first and second amplifiers are directly connected. The single impedance matching network is configured to transform an impedance of the antenna into a resistance at the shared node. A control circuit is coupled to control the impedance transformation of the single impedance matching network, so as to provide a first resistance at the shared node during RX mode and a second resistance at the shared node during TX mode, wherein the second resistance is different from the first resistance.