Single-Laminate Galvanic Isolator Assembly
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Solution Overview
Problem
Existing isolators face challenges in maintaining galvanic isolation while allowing communication between devices operating in different power regimes, requiring effective isolation to prevent damage from current flow and fault conditions, and traditional methods are complex and costly.
Innovation Solution
The use of a laminate with integrated conductive traces and discrete surface mount capacitors or other isolation devices, where the isolation barrier is located above the laminate, providing a high breakdown voltage and efficient signal transmission while minimizing latency and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional split paddle assembly process is used with separate substrates, then galvanic isolation is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple separate substrates into a single laminate structure with integrated conductive traces. The isolation barrier, first die, second die, and conductive traces are all formed on or within one laminate, eliminating the need for separate substrates and reducing assembly complexity while maintaining galvanic isolation functionality.
Solution Approach 2:
The single laminate structure serves multiple functions simultaneously: it provides mechanical support, contains integrated conductive traces for signal transmission, hosts the isolation barrier, and maintains galvanic isolation. This multi-functional design replaces the need for multiple specialized components in traditional split paddle assemblies.
2Reliability
If isolation devices are formed in the substrate, then power hold-off capability increases, but manufacturing complexity increases
Solution Approach 1:
The isolation barrier is positioned above the laminate surface rather than being formed within the substrate layers. This dimensional relocation allows the use of standard substrate fabrication processes while achieving high power hold-off capability through the vertical placement of capacitors and isolation structures above the conductive traces.
3Reliability
If separate substrates are used for each side of isolator, then galvanic isolation is maintained, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple separate substrates into a single laminate structure that provides galvanic isolation functionality. By integrating the isolation barrier, conductive traces, and die attachments on one laminate rather than using separate substrates, the manufacturing process is simplified and costs are reduced while maintaining isolation performance.
4Speed
If discrete capacitor is used for isolation barrier located above laminate, then signal transmission efficiency improves, but assembly complexity increases
Solution Approach 1:
The discrete capacitor is positioned above the laminate surface in the vertical dimension, creating a compact three-dimensional structure. This vertical placement allows efficient signal transmission through the isolation barrier while maintaining a compact overall assembly, as the capacitor connects to conductive traces on the laminate surface without requiring lateral expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables robust galvanic isolation with high power hold-off capability, reduced latency, and cost-effectiveness by using a single laminate with multiple dies and discrete isolation devices, enhancing the stability and reliability of the isolator assembly.
Implementation Method 1
an isolation barrier comprising a discrete capacitor connected to the first conductive trace and the second conductive trace
Implementation Method 2
The second die is galvanically isolated from the first die by the isolation barrier
Data Source
AI summary
An isolator assembly is disclosed. The assembly comprises a laminate consisting essentially of a block of homogenous material and a set of electrical contacts. A first die is coupled to a surface of the laminate. An isolation barrier is located entirely above the surface of the laminate. A second die is coupled to the laminate. The second die is galvanically isolated from the first die by the isolation barrier. The second die is in operative communication with the first die via the isolation barrier and a conductive trace on the laminate. The first die, the second die, the laminate, and the isolation barrier are all contained within an assembly package.