Single-Layer Millimeter-Wave Antenna Unit for Broadband Isolation
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Solution Overview
Problem
Existing millimeter-wave antennas face challenges in achieving broadband performance while maintaining small size and high stability due to the need for multiple dielectric layers, which increase thickness and complexity, contradicting the thin and light development trend of electronic devices.
Innovation Solution
The antenna unit employs a single-layer dielectric substrate with parasitic patches and radiation patches coupled via an indirect feeding mechanism, utilizing electromagnetic induction through a coupling gap to reduce thickness and interconnection interference, allowing for flexible arrangement and improved signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple dielectric layers are used to achieve broadband performance, then the antenna bandwidth is improved, but the antenna thickness and structural complexity increase
Solution Approach 1:
The antenna is divided into functional segments: a radiation patch for broadband radiation, a parasitic patch for impedance transformation and bandwidth extension, and a single dielectric layer for support. This segmentation allows each component to perform its specific function efficiently without requiring multiple stacked dielectric layers, thus achieving broadband performance with reduced thickness.
Solution Approach 2:
The parasitic patch acts as an intermediary element between the feed line and the radiation patch. It couples electromagnetic energy from the feed to the radiation patch through electromagnetic induction, enabling broadband operation without requiring multiple dielectric layers. The parasitic patch mediates the impedance matching and bandwidth extension while maintaining a thin single-layer structure.
2Adaptability or versatility
If multiple dielectric layers are used to achieve broadband performance, then the antenna bandwidth is improved, but the device complexity increases
Solution Approach 1:
The antenna structure is segmented into distinct functional elements (feed line, parasitic patch, radiation patch) that can be independently designed and optimized. This segmentation simplifies the overall structure by avoiding the need for complex multi-layer dielectric stacks, making the antenna easier to manufacture and integrate while achieving broadband performance.
Solution Approach 2:
The parasitic patch and radiation patch are merged into a single planar structure on one dielectric layer, eliminating the need for multiple stacked layers. This merging reduces structural complexity and manufacturing difficulty while maintaining the broadband characteristics through the coupled resonance of the two patches.
3Volume of moving object
If the antenna size is reduced to meet thin and light trends, then the portability is improved, but the radiation performance and stability deteriorate
Solution Approach 1:
The antenna transitions from a vertical multi-layer structure to a horizontal planar structure. By expanding the radiation and parasitic patches in the planar dimensions rather than stacking dielectric layers vertically, the antenna achieves compact size while maintaining stable radiation performance through the distributed current paths on the patch surfaces.
Solution Approach 2:
The antenna uses parasitic patches with specific size ratios (L3/L4 = 1-2) and coupling gap dimensions (L1/L2 = 5-10) to optimize the electromagnetic resonance characteristics. By carefully controlling these geometric parameters, the antenna achieves stable radiation patterns and broadband performance within a compact form factor suitable for thin devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves miniaturization, broadband operation, high polarization isolation, and stable radiation patterns, aligning with the thin and light trends of electronic devices while reducing manufacturing complexity and cost.
Implementation Method 1
utilizing electromagnetic induction through a coupling gap to reduce thickness and interconnection interference
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
An antenna unit includes: a radiation assembly (1) including at least one parasitic patch (11) and at least one radiation patch (12); a dielectric layer (2) including a layer of dielectric substrate; a floor layer (3); and at least one feed structure (4), wherein the radiation assembly (1) is located on a top surface (201) of the dielectric layer (2); the floor layer (3) is located on a bottom surface of the dielectric layer (2); and the least one feed structure (4) passes through the floor layer (3) and the dielectric layer (2) sequentially and is electrically connected to the at least one parasitic patch (11), and the at least one parasitic patch (11) is coupled to the at least one radiation patch (12).