Single-Layer Circuit Board Routing Under Components

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Solution Overview

Problem

The existing LED light bars use a two-layer board copper foil routing to prevent circuit shorting, which increases material and manufacturing costs and reduces the flexibility of the flexible circuit board.

Innovation Solution

A circuit board design that uses a single-layer board structure with electronic components having contacts that allow the second circuit to pass under or between them, preventing shorting without the need for a two-layer board, thereby maintaining flexibility and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two-layer board copper foil routing is used to prevent circuit shorting, then circuit reliability is improved, but material cost and manufacturing cost increase, and flexibility of the flexible circuit board deteriorates

Engineering Contradiction:
Improvecircuit reliabilityVSAvoidboard structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies dimensional change by routing the second circuit through the vertical dimension (underneath electronic components) rather than only on the same plane. This allows the first and second circuits to be coplanar while preventing shorting by utilizing the third dimension (depth/thickness) of the board structure, enabling single-layer routing without sacrificing reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The second circuit is nested underneath the electronic components, effectively placing one circuit layer within the structural envelope of another. This nesting arrangement allows multiple circuits to coexist on a single-layer board without interference, as the second circuit passes through the bottom of electronic components between their first and second contacts.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If two-layer board copper foil routing is used to prevent circuit shorting, then circuit reliability is improved, but material cost increases

Engineering Contradiction:
Improvecircuit reliabilityVSAvoidmaterial cost
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent merges the routing functions into a single layer by utilizing the vertical space underneath electronic components. Instead of requiring separate first and second copper foil layers, the design combines multiple circuit paths into one layered structure where the second circuit passes through the bottom of electronic components, thereby reducing material consumption while maintaining circuit isolation and reliability.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If two-layer board copper foil routing is used to prevent circuit shorting, then circuit reliability is improved, but flexibility of the flexible circuit board deteriorates

Engineering Contradiction:
Improvecircuit reliabilityVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

By routing the second circuit through the vertical dimension (underneath components) rather than requiring a separate planar layer, the patent eliminates the need for a second copper foil layer. This dimensional approach maintains the single-layer flexible circuit board structure, preserving its flexibility and ease of bending while still preventing circuit shorting through the bottom-of-component routing path.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8746925B2Circuit board circuit apparatus and light source apparatus
Publication Date: 2014.06.10 AU OPTRONICS CORP
  • US8746925B2 patent drawing
  • US8746925B2 patent drawing
  • US8746925B2 patent drawing

AI summary

A circuit board circuit apparatus and a light source apparatus including a substrate, a circuit layer, and at least one electronic component are disclosed. The circuit layer is formed on a surface of the substrate. The circuit layer includes a first circuit and a second circuit which are coplanar-disposed. The at least one electronic component is disposed on the circuit layer and connected with the circuit layer. Each electronic component has a first contact and a second contact. At least a part of the second circuit is disposed between the at least one electronic component and the first circuit. The at least one electronic component crosses over the second circuit, so that the second circuit penetrates through the bottom of the electronic component between the first contact and the second contact.