Single-Layer Circuit Wire Crossing via Horizontal Surface Routing
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Solution Overview
Problem
Conventional circuit wire crossing structures require multilayer substrates with through-holes, which are not feasible for weak or sensitive substrates, necessitating a new approach for single-layer circuit designs.
Innovation Solution
A circuit wire crossing structure featuring a substrate with lateral wires and a central wire, where an electronic component with an insulating shell connects to the lateral wires' terminals, allowing signal transmission without direct contact with the central wire, and a manufacturing method involving substrate preparation, wire formation, and component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional multilayer substrate with through-holes is used for wire crossing, then wire crossing is achieved, but substrate strength and sensitivity are compromised
Solution Approach 1:
The patent transitions from vertical wire crossing (requiring through-holes in multilayer substrates) to horizontal wire crossing on the same plane. By arranging wires to cross on the surface level rather than penetrating through the substrate, the solution eliminates the need for through-hole drilling that compromises substrate strength.
Solution Approach 2:
The patent extracts the wire crossing function from the vertical dimension (through-holes) and relocates it to the horizontal dimension (surface crossing). This separation removes the harmful through-hole structure while preserving the essential wire crossing capability.
2Ease of operation
If multilayer substrate with through-holes is used, then wire crossing is realized, but substrate sensitivity is increased
Solution Approach 1:
The patent moves the wire crossing operation from the vertical dimension (requiring substrate penetration) to the horizontal dimension (surface-level crossing). This dimensional shift eliminates the need for through-holes that increase substrate sensitivity to external factors.
Solution Approach 2:
The patent extracts the wire crossing function from the sensitive vertical through-hole structure and implements it as a surface-level horizontal crossing. This extraction removes the source of increased substrate sensitivity while maintaining crossing functionality.
3Strength
If single-layer substrate is used, then substrate strength is maintained, but wire crossing becomes difficult
Solution Approach 1:
The patent solves the wire crossing difficulty in single-layer substrates by utilizing the horizontal dimension for crossing. Instead of attempting vertical crossing (which requires through-holes), the design arranges wires to cross on the surface level, making wire crossing feasible while preserving substrate strength.
4Ease of operation
If conventional wire crossing structure is used, then wire crossing is achieved, but circuit pattern complexity increases
Solution Approach 1:
The patent simplifies circuit patterns by implementing wire crossing on the same plane rather than requiring multilayer stacking. This horizontal crossing approach reduces the number of layers and through-holes needed, thereby simplifying the overall circuit pattern while maintaining crossing capability.
Data Source
AI summary
A circuit wire crossing structure, comprising a substrate with a supporting surface, an electrical circuit disposed on the supporting surface of the substrate, with the electrical circuit comprising, two lateral wires with one of the wires having a first terminal and a second terminal and another one of the lateral wires having a second terminal, wherein the first terminal and the second terminal are spaced apart from each other, and a central wire, disposed between and apart from the first terminal and the second terminal, and an electronic component arranged above the supporting surface and two terminals of the electronic component connecting with the first terminal and the second terminal, wherein the electronic component has an insulating shell facing the central wire, and an orthographic projection of the electronic component to the supporting surface extends across an orthographic projection of the central wire to the supporting surface.