Single Layer Clip for Lateral Semiconductor Signal Redistribution
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Solution Overview
Problem
Conventional semiconductor packages face challenges in efficiently redistributing and isolating source, drain, and gate signals in lateral semiconductor devices, particularly during the reflow process, which can lead to alignment issues and increased resistance.
Innovation Solution
A semiconductor package design incorporating a single layer clip with multiple fingers, coupled to a leadframe, that redistributes and isolates signals by using standoff contacts arranged in a staggered pattern, allowing self-alignment during fabrication and reducing the component count by eliminating additional clips and wirebonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple clips and wirebonding are used to connect source, drain, and gate regions, then electrical connections can be established, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple separate clips into a single integrated clip structure that simultaneously connects source, drain, and gate regions. This single clip integrates the functions of what would traditionally require multiple separate clips and wirebonds, reducing structural complexity while maintaining reliable electrical connections across all device regions
Solution Approach 2:
The single clip structure serves multiple functions simultaneously: it provides mechanical support, establishes electrical connections to source regions, drain regions, and gate regions, and enables signal redistribution. This multi-functional design eliminates the need for separate components for each function, reducing overall device complexity
2Ease of manufacture
If conventional leadframe packages are used, then manufacturing is simplified, but signal redistribution and isolation capabilities are insufficient
Solution Approach 1:
The single clip is divided into multiple fingers or segments that can be independently configured to connect to different device regions. This segmentation allows the clip to perform signal redistribution by routing signals through different paths, while the entire structure remains manufacturable as a single integrated component using standard leadframe processes
Solution Approach 2:
The clip structure extends in multiple dimensions with fingers reaching toward source, drain, and gate regions. This three-dimensional configuration enables signal redistribution capabilities within a single layer, adding functional versatility without requiring multiple stacked layers or complex vertical interconnections
3Reliability
If additional clips and wirebonds are used for signal isolation, then signal integrity improves, but manufacturing precision requirements increase
Solution Approach 1:
The single clip structure is designed to self-align with the device during the reflow process. The clip's geometry and the staggered arrangement of contact points enable automatic positioning without requiring high-precision external alignment fixtures or complex assembly steps, reducing manufacturing precision requirements while maintaining effective signal isolation
4Device complexity
If a single layer clip is used, then device complexity is reduced, but alignment precision during fabrication may be compromised
Solution Approach 1:
The single layer clip incorporates self-aligning features where its geometry and contact point arrangement enable automatic positioning during reflow. The staggered pattern of contact points and the clip's overall shape guide proper alignment without requiring external alignment mechanisms, maintaining manufacturing precision while keeping the structure simple and single-layer
Data Source
AI summary
A semiconductor package. Implementations may include a lateral device that may include a lateral semiconductor device including one of interspersed and interdigitated source and drain regions and one or more gate regions, a single layer clip, and a leadframe. The single layer clip may be coupled to the one of interspersed and interdigitated source and drain regions and the one or more gate regions and to the leadframe. The single layer clip may be configured to redistribute and to isolate source, drain, and gate signals passing into and out from the lateral semiconductor device during operation of the semiconductor device package.